EFOS8384E5

Manufacturer Part NumberEFOS8384E5
ManufacturerPanasonic Electric Works
EFOS8384E5 datasheet
 


Specifications of EFOS8384E5

Lead Free Status / RoHS StatusCompliant  
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Ceramic Res o na tors, Chip Type
(3 Array Type)
EFOS
Type:
EFOB
Type:
EFOSS
Type:
EFOSM
Type:
EFOBM
Type:
EFOJM
Type:
EFOST
Type:
Features
● Encased in a ceramic package
● High reliability against soldering heat and mechanical
stress
● Moisture-proof sealing
● 1.2 mm maximum (SS/SM/BM/JM),
0.8 mm maximum (ST) in thickness
● Designed for refl ow soldering
● Flat-bottom plate for better mountings
● Simplifi es oscillation circuits by reducing the number
of circuit parts
● RoHS compliant
Explanation of Part Numbers
1
2
3
E
F
O
Product Code
Ceramic
Built-In Capacitors
EFO
Type with 3-terminals
Resonators
S
13.1 to 20 MHz
B
1
2
3
E
F
O
Product Code
Built-In Capacitors
Ceramic
EFO
Type with 3-terminals
Resonators
SS
SM
BM
JM
ST
Frequency range
Part Number
EFOS
EFOB
EFOSS
EFOSM
EFOBM
EFOJM
EFOST
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Recommended Applications
● Clock generator for microprocessors
● Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
Handling Precautions
Packaging Specifi cations
See Page 169 to 177
4
5
6
7
8
3
5
8
4
Nominal Oscillation
Type
Frequency
3584
3.58 MHz
2 to 13 MHz
1695
16.93 MHz
(Example)
4
5
6
7
8
4
0
0
Nominal Oscillation
Type
Frequency
4004
4.00 MHz
4 to 13 MHz
16.93 MHz
1695
4 to 13 MHz
2005
20.00 MHz
12 to 20 MHz
4005
40.00 MHz
16 to 20 MHz
(Example)
30 to 50 MHz
8 to 20 MHz
Frequency Temperature Characteristics
(MHz)
(–20 to +80 °C)
2.00 to 8.39
8.40 to 13.0
13.1 to 20.0
4.00 to 8.39
8.40 to 13.0
4.00 to 8.39
8.40 to 13.0
12.0 to 20.0
16.0 to 20.0
30.0 to 50.0
8.00 to 12.9
13.0 to 20.0
– EC166 –
Ceramic Resonators, Chip Type
(See Page 175 to 176)
9
10
11
12
Design No.
Frequency
Packaging Style
Tolerance
B
Bulk Pack
±1.0 %
0
Embossed
E
±0.3 %
Taping
3
±0.5 %
5
9
10
11
12
4
Design No.
Frequency
Packaging Style
Tolerance
B
Bulk Pack
±1.0 %
0
Embossed
E
±0.3 %
Taping
3
±0.5 %
5
Built-in Capacitors
(Reference)
±0.2 %
33 pF
±1.0 %
±0.5 %
33 pF
±0.2 %
21 pF
±0.3 %
±0.2 %
33 pF
±1.0 %
±0.3 %
18 pF
±0.5 %
10 pF
±0.2 %
±0.2 %
15 pF
±0.5 %
00
Apr. 2008

EFOS8384E5 Summary of contents

  • Page 1

    ... EC166 – Ceramic Resonators, Chip Type (See Page 175 to 176 Design No. Frequency Packaging Style Tolerance B Bulk Pack ±1.0 % ...

  • Page 2

    ... Serial No. (2.70) +0.30 3.20 –0.20 6–R(0.20) [Type EFOSS] (1.60) 2.00±0.30 [Type EFOB] (2.70) +0.25 3.20 –0.15 – EC167 – Ceramic Resonators, Chip Type 2.5 2.5 3-0.9 to 1.2 1.5 1.5 3-0.55 3-0.8 1.9 1.9 3-1.2 00 Apr. 2008 ...

  • Page 3

    ... Excluding 0. G=20 log (V0/ V1) OUT FET probe min max. Ceramic Resonator – EC168 – Ceramic Resonators, Chip Type 1.351.35 3-0.8 1.6 1.6 3-0.7 to 1.0 1.2 1.2 3-0.4 Frequency µPD4069UBC, 2.00 to 8.39 MHz TC4069UBP or similar µPD74HCU, ST 8.40 to 50.0 MHz TC74 HCU04AP or similar µ ...

  • Page 4

    ... Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Ceramic Resonators, Chip Type Type EFOB ...

  • Page 5

    ... Feeding hole Dim. 1 (mm Dim (mm 6.0±0.2 4.6±0.2 4.9±0.2 – EC170 – Ceramic Resonators, Chip Type Feeding hole φD Chip pocket Chip Component Tape running direction 2.6±0.2 5.1±0.2 12.0±0.3 5.5±0.1 1.75±0.10 4.0±0.1 φ ...