PBSS306NZ,135 NXP Semiconductors, PBSS306NZ,135 Datasheet
PBSS306NZ,135
Specifications of PBSS306NZ,135
PBSS306NZ /T3
PBSS306NZ /T3
Related parts for PBSS306NZ,135
PBSS306NZ,135 Summary of contents
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PBSS306NZ 100 V, 5.1 A NPN low V Rev. 02 — 11 December 2009 1. Product profile 1.1 General description NPN low V small Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS306PZ. 1.2 Features Low collector-emitter saturation voltage V High ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBSS306NZ 4. Marking Table 4. Type number PBSS306NZ PBSS306NZ_2 Product data sheet Pinning Description base collector emitter collector Ordering information Package Name Description SC-73 plastic surface-mounted package with increased heatsink; 4 leads Marking codes Rev. 02 — ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm [3] Device mounted on a ceramic PCB th(j-a) (K/W) δ 0.75 ...
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... NXP Semiconductors 2 10 δ 0.75 Z th(j-a) 0.50 (K/W) 0.33 0.20 10 0.10 0.05 0.02 0. −1 10 −5 − FR4 PCB, mounting pad for collector 6 cm Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 2 10 δ 0.75 Z th(j-a) (K/W) ...
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... NXP Semiconductors 7. Characteristics Table amb Symbol I CBO I EBO CEsat R CEsat V BEsat V BEon off [1] Pulse test: t PBSS306NZ_2 Product data sheet Characteristics ° C unless otherwise specified. Parameter Conditions collector-base cut-off current 150 ° emitter-base cut-off current DC current gain collector-emitter saturation voltage 5 collector-emitter ...
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... NXP Semiconductors 600 h FE (1) 400 (2) (3) 200 0 − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 5. DC current gain as a function of collector current; typical values 1 (V) 0.8 (1) (2) 0.4 (3) 0 − −55 °C (1) T amb = 25 °C (2) T amb = 100 ° ...
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... NXP Semiconductors 1 V CEsat (V) −1 10 −2 10 − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values CEsat (Ω −1 10 −2 10 − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C ...
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... NXP Semiconductors 8. Test information Fig 13. BISS transistor switching time definition Fig 14. Test circuit for switching times PBSS306NZ_2 Product data sheet (probe) oscilloscope 450 Ω 12 0. Bon Rev. 02 — 11 December 2009 PBSS306NZ 100 V, 5.1 A NPN low V CEsat I (100 %) Bon I Boff off (probe) ...
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... NXP Semiconductors 9. Package outline Fig 15. Package outline SOT223 (SC-73) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PBSS306NZ [1] For further information and the availability of packing methods, see PBSS306NZ_2 Product data sheet 6.7 6 ...
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... NXP Semiconductors 11. Soldering 1.3 (4×) (4×) Fig 16. Reflow soldering footprint 1.9 Fig 17. Wave soldering footprint PBSS306NZ_2 Product data sheet 7 3.85 3.6 3.5 0.3 1 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 8.9 6 2.7 2.7 1.9 1.1 (2×) Rev. 02 — 11 December 2009 PBSS306NZ 100 V, 5 ...
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... Revision history Document ID Release date PBSS306NZ_2 20091211 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 16 “Reflow soldering • Figure 17 “Wave soldering ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Packing information . . . . . . . . . . . . . . . . . . . . 10 11 Soldering ...