PXTA92,115 NXP Semiconductors, PXTA92,115 Datasheet

TRANS PNP 300V 100MA SOT89

PXTA92,115

Manufacturer Part Number
PXTA92,115
Description
TRANS PNP 300V 100MA SOT89
Manufacturer
NXP Semiconductors
Series
-r
Datasheet

Specifications of PXTA92,115

Transistor Type
PNP
Current - Collector (ic) (max)
100mA
Voltage - Collector Emitter Breakdown (max)
300V
Vce Saturation (max) @ Ib, Ic
500mV @ 2mA, 20mA
Dc Current Gain (hfe) (min) @ Ic, Vce
25 @ 30mA, 10V
Power - Max
1.3W
Frequency - Transition
50MHz
Mounting Type
Surface Mount
Package / Case
SC-62, SOT-89, TO-243 (3 Leads + Tab)
Current - Collector Cutoff (max)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Collector Cutoff (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
933926800115
PXTA92 T/R
PXTA92 T/R
Product data sheet
Supersedes data of 1999 Apr 29
dbook, halfpage
DATA SHEET
PXTA92
PNP high-voltage transistor
DISCRETE SEMICONDUCTORS
M3D109
2004 Dec 09

Related parts for PXTA92,115

PXTA92,115 Summary of contents

Page 1

DATA SHEET dbook, halfpage PXTA92 PNP high-voltage transistor Product data sheet Supersedes data of 1999 Apr 29 DISCRETE SEMICONDUCTORS M3D109 2004 Dec 09 ...

Page 2

... NXP Semiconductors PNP high-voltage transistor FEATURES • Low current (max. 100 mA) • High voltage (max. 300 V). APPLICATIONS • Telephony and professional communication equipment. DESCRIPTION PNP high-voltage transistor in a SOT89 plastic package. NPN complement: PXTA42. MARKING TYPE NUMBER PXTA92 *1N Note Made in Hong Kong. ...

Page 3

... NXP Semiconductors PNP high-voltage transistor THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient th(j-a) R thermal resistance from junction to soldering point th(j-s) Note 1. Device mounted on a printed-circuit board, single-sided copper, tin-plated, mounting pad for collector 6 cm For other mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”. ...

Page 4

... NXP Semiconductors PNP high-voltage transistor PACKAGE OUTLINE Plastic surface-mounted package; collector pad for good heat transfer; 3 leads w M DIMENSIONS (mm are the original dimensions) UNIT 1.6 0.48 0.53 1.8 mm 1.4 0.35 0.40 1.4 OUTLINE VERSION IEC SOT89 2004 Dec scale 0.44 4.6 2 ...

Page 5

... NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. ...

Page 6

... NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www ...

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