BCV61,215 NXP Semiconductors, BCV61,215 Datasheet
BCV61,215
Specifications of BCV61,215
BCV61 T/R
BCV61 T/R
Related parts for BCV61,215
BCV61,215 Summary of contents
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BCV61 NPN general-purpose double transistors Rev. 04 — 18 December 2009 1. Product profile 1.1 General description NPN general-purpose double transistors in a small SOT143B Surface-Mounted Device (SMD) plastic package. Table 1. Type number BCV61 BCV61A BCV61B BCV61C 1.2 Features ...
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... NXP Semiconductors 3. Ordering information Table 3. Type number BCV61 BCV61A BCV61B BCV61C 4. Marking Table 4. Type number BCV61 BCV61A BCV61B BCV61C [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) [1] Device mounted on an FR4 PCB. 7. Characteristics Table 7. ° Symbol Parameter Transistor TR1 I CBO I EBO CEsat V BEsat BCV61_4 Product data sheet Thermal characteristics Parameter thermal resistance from junction to ambient Characteristics C unless otherwise specified. collector-base cut-off current ...
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... NXP Semiconductors Table 7. ° Symbol Parameter Transistor TR2 V EBS h FE Transistors TR1 and TR2 [1] V BEsat [ [3] Device, without emitter resistors, mounted on an FR4 PCB. BCV61_4 Product data sheet Characteristics …continued C unless otherwise specified. emitter-base voltage DC current gain BCV61 BCV61A BCV61B BCV61C ...
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... NXP Semiconductors 400 h FE (1) 300 (2) 200 (3) 100 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 1. BCV61A: DC current gain as a function of collector current; typical values CEsat (mV (1) (2) (3) 10 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C ...
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... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 5. BCV61B: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − 150 °C (1) T amb = 25 °C (2) T amb = − ...
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... NXP Semiconductors 1200 h FE 1000 (1) 800 (2) 600 400 (3) 200 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 9. BCV61C: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − 150 °C (1) T amb = 25 °C (2) T amb = − ...
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... NXP Semiconductors V CE1max Fig 13. Maximum collector-emitter voltage as a function of emitter resistance 8. Test information Fig 14. Test circuit current matching Fig 15. BCV61 with emitter resistors BCV61_4 Product data sheet 30 ( − 1 CE1 CE1 Rev. 04 — 18 December 2009 NPN general-purpose double transistors (Ω TR1 TR2 ...
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... NXP Semiconductors 9. Package outline Fig 16. Package outline SOT143B 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BCV61 BCV61A BCV61B BCV61C [1] For further information and the availability of packing methods, see BCV61_4 Product data sheet 3 ...
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... NXP Semiconductors 11. Soldering 0.7 (3×) 0.7 Fig 17. Reflow soldering footprint SOT143B 4.6 Fig 18. Wave soldering footprint SOT143B BCV61_4 Product data sheet 3.25 0.6 (3×) 0.5 (3×) 1.9 0.6 (3×) 0.6 0.75 0.95 0.9 1 4.45 2.2 2.575 1.2 Rev. 04 — 18 December 2009 ...
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... Document ID Release date BCV61_4 20091218 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 3 “Ordering • Section 4 • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information . . . . . . . . . . . . . . . . . . . . . 9 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Legal information ...