Conn High Density RCP 200 POS 1.3mm Solder ST SMD Tray


Manufacturer Part Number5-1761615-5
DescriptionConn High Density RCP 200 POS 1.3mm Solder ST SMD Tray
ManufacturerTE Connectivity
TypeHigh Density
5-1761615-5 datasheets

Specifications of 5-1761615-5

Pitch1.3 mmNumber Of Rows2
Number Of Contacts200Termination MethodSolder
MountingSurface MountContact PlatingGold Over Nickel
Pitch (mm)1.3mmGenderRCP
Body OrientationStraightNumber Of Contact Rows2
Mounting StyleSurface MountContact MaterialCopper Alloy
Housing MaterialThermoplasticProduct Depth (mm)28.6mm
Product Length (mm)38.15mmSolder BallTin-Silver
Product Height5mmNumber Of Positions200
Vacuum CoverWithContact TypeSocket
Contact Base MaterialCopper AlloyContact FinishGold (30) over Nickel (50)
Connector StyleReceptacleStack Height (mm [in])15.00 [0.591], 17.00 [0.669], 18.00 [0.709], 20.00 [0.787], 25.00 [0.984], 30.00 [1.181]
Rohs/elv ComplianceRoHS compliant, ELV compliantLead Free Solder ProcessesReflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance HistoryAlways was RoHS compliantPackaging MethodTray
Lead Free Status / RoHS StatusCompliant  
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