2-1761607-7 TE Connectivity, 2-1761607-7 Datasheet

Conn Ejector Header HDR 20 POS 2.54mm Solder RA Thru-Hole

2-1761607-7

Manufacturer Part Number
2-1761607-7
Description
Conn Ejector Header HDR 20 POS 2.54mm Solder RA Thru-Hole
Manufacturer
TE Connectivity
Type
Ejector Headerr
Series
AMP-LATCHr
Datasheet

Specifications of 2-1761607-7

Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
20
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Connector Type
Wire To Board
Contact Termination
Right Angle Through Hole
No. Of Contacts
20
No. Of Rows
2
Pitch Spacing
2.54mm
Connector
RoHS Compliant
Product Line
AMP-LATCH
Profile
Low
Pcb Mounting Orientation
Right Angle
Pcb Mount Retention
Without
Mating Connector Lock
Without
Housing Style
4-Sided
Ejection Latches
With
Post Size (mm [in])
0.64 [.025]
Shrouded
Yes
[shrouded] End Dimension (mm [in])
3.81 [0.150]
Termination Post Length (mm [in])
2.60 [0.102]
Solder Tail Contact Plating
Tin over Nickel
Header Type
Pin Header
Number Of Positions
20
Centerline, Matrix (mm [in])
2.54 x 2.54 [.100 x .100]
Daisy Chain
With
Preloaded
Yes
Contact Plating, Mating Area, Material
Gold Flash over Palladium Nickel
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Connector Style
Header - Pin
Mating Alignment Type
Center, Military
Mating Alignment
With
Housing Material
Thermoplastic - GF
Ul Flammability Rating
UL 94V-0
Housing Color
Blue
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Rohs/elv Compliance History
Always was RoHS compliant
Temperature Rating
Standard
1.
1.1.
1.2.
1.3.
2.
2.1.
2.2.
2.3.
3.
3.1.
3.2.
©2011 Tyco Electronics Corporation,
a TE Connectivity Ltd. Company
All Rights Reserved
TE logo is a trademark.
SCOPE
Content
This specification covers perform ance, tests and quality requirem ents for AMP-LATCH* universal and
low profile, and IDC standard and low profile .100 X .100 inch grid headers, right angle and vertical
assem blies.
Qualification
W hen tests are perform ed on subject product line, procedures specified in Figure 1 shall be used. All
inspections shall be perform ed using applicable inspection plan and product drawing.
Successful qualification testing on the subject product line was com pleted on 03Nov95, additional
testing was com pleted on 23Feb10. The Qualification Test Report num ber for this testing is 501-325.
This docum entation is on file at and available from Engineering Practices and Standards (EPS).
APPLICABLE DOCUM ENTS
The following docum ents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the docum ent applies. In the event of conflict between the
requirem ents of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirem ents of this specification and referenced docum ents, this
specification shall take precedence.
TE Connectivity (TE) Docum ents
!
!
!
Industry Docum ent
EIA-364: Electrical Connector/Socket Test Procedures Including Environm ental Classifications
Reference Docum ent
109-197: Test Specification (Tyco Electronics Test Specifications vs EIA and IEC Test Methods)
REQUIREM ENTS
Design and Construction
Product shall be of design, construction and physical dim ensions specified on applicable product
drawing.
Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
109-1: Test Specification (General Requirem ents for Test Specifications)
109 Series: Test Specifications as indicated in Figure 1
501-325: Qualification Test Report (Connector, AMPLATCH* Header, .100 X .100 Inch Grid)
| Indicates change
*Trademark
Product
Specification
AMP-LATCH* and IDC Header Connectors, .100 X .100 Inch Grid
For latest revision, visit our website at www.te.com/documents.
For Regional Customer Service, visit our website at www.te.com
Other products, logos, and company names might be trademarks of their respective owners.
108-40018
11Mar11 Rev F
1 of 5
LOC B

Related parts for 2-1761607-7

2-1761607-7 Summary of contents

Page 1

... Successful qualification testing on the subject product line was com pleted on 03Nov95, additional testing was com pleted on 23Feb10. The Qualification Test Report num ber for this testing is 501-325. This docum entation is on file at and available from Engineering Practices and Standards (EPS). ...

Page 2

... Figure 1 (continued) 108-40018 Procedure Visual, dim ensional and functional per applicable quality inspection plan. EIA-364-21. 500 volts DC inute hold. Test between adjacent contacts of unm ated specim ens. EIA-364-20, Condition I. 1000 volts AC at sea level. Test between adjacent contacts of unm ated specim ens. ...

Page 3

... Test Description Therm al shock. Hum idity/tem perature cycling. Shall meet visual requirements, show no physical damage and shall meet requirements of NOTE additional tests as specified in Test Sequence in Figure 2. 3.6. Product Qualification and Requalification Test Sequence Exam ination of product Insulation resistance W ithstanding voltage Solderability ...

Page 4

... All test groups shall each consist inim headers of each type. B. Test Sequence Qualification inspection shall be verified by testing specim ens as specified in Figure 2. 4.2. Requalification Testing If changes significantly affecting form , fit or function are m ade to the product or m anufacturing process, product assurance shall coordinate requalification testing, consisting of all or part of the original testing sequence as determ ined by developm ent/product, quality and reliability engineering ...

Page 5

AMP-LATCH Universal Header IDC Standard Profile Header Rev F AMP-LATCH Low Profile Header IDC Low Profile Header Figure 3 Contact Retention 108-40018 ...

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