HCP0805-2R2-R Cooper/Bussmann, HCP0805-2R2-R Datasheet

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HCP0805-2R2-R

Manufacturer Part Number
HCP0805-2R2-R
Description
Power Inductors 2.2uH 14A
Manufacturer
Cooper/Bussmann
Series
HCP0805r
Datasheet

Specifications of HCP0805-2R2-R

Product
Inductors
Test Frequency
100 KHz
Inductance
2.2 uH
Tolerance
25 %
Maximum Dc Current
14 Amps
Maximum Dc Resistance
11.872 mOhms
Dimensions
7.9 mm W x 7.6 mm L x 5 mm H
Operating Temperature Range
- 40 C to + 125 C
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCP0805-2R2-R
Manufacturer:
OOPER
Quantity:
20 000
High Current, High Frequency, Power Inductors
HCP0805 Series
Description:
• Halogen free
• 125°C maximum total temperature operation
• 7.6 x 7.9 x 5.0mm surface mount package
• Powder iron core material
• Magnetically shielded, low EMI
• High current carrying capacity, Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 0.40μH to 2.2μH
• Current range from 10.0 to 32 amps
• Frequency range up to 2MHz
• RoHS compliant
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms , 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms , I sat 1
3 I rms : DC current for an approximate temperature rise of 40°C without core loss. Derating is
1108
Part Number
HCP0805-R40-R
HCP0805-R68-R
HCP0805-1R0-R
HCP0805-1R5-R
HCP0805-2R2-R
SMD Device
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
BU-SB08798
6
OCL
1
± 20% (μH)
0.40
0.68
1.00
1.50
2.20
FLL
2
Min. (μH)
0.26
0.44
0.64
0.96
1.41
Product Specifications
I rms
17.5
14.5
13.3
3
20
10
(Amps)
4 I sat : Peak current for approximately 20% rolloff at +25°C.
5 K-factor: Used to determine B p-p for core loss (see graph). B p-p = K * L * ΔI. B p-p : (Gauss), K:
6 Part Number Definition: HCP0805-xxx-R
Applications:
• Voltage Regulator Module (VRM)
• Multi-phase regulators
• Desktop and servers
• Base station equipment
• Notebook regulators
• Data networking and storage systems
• Point-of-load modules
• Battery power systems
• DCR sensing
Environmental Data:
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
• Solder reflow temperature: J-STD-020D compliant
Packaging:
• Supplied in tape-and-reel packaging, 700 parts per reel,
(K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).
• HCP0805 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then
• “-R” suffix = RoHS compliant
third character = # of zeros.
(Range is application specific)
13” diameter reel
Page 1 of 4
I sat
4
@ 25°C (Amps)
32
25
22
18
14
Data Sheet: 4349
DCR (mΩ) @ 20°C
11.2 ±6.0%
3.1 ±6.0%
4.5 ±6.0%
5.8 ±6.0%
6.8 ±6.0%
K-factor
376.0
292.0
239.0
202.0
175.0
5

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HCP0805-2R2-R Summary of contents

Page 1

... HCP0805-1R0-R 1.00 HCP0805-1R5-R 1.50 HCP0805-2R2-R 2.20 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms , 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms , I sat rms : DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise recommended the part temperature not exceed 125° ...

Page 2

... R 2 The nominal DCR is measured from point “a” to point”b.” xxx = Inductance value in μ Decimal point “R” is present, then last character zeros Part Marking: HCP0805 Packaging Information - mm 1.5 Dia Section A-A 5.2 Supplied in tape-and-reel packaging, 700 parts per reel, 13” diameter reel. ...

Page 3

Core Loss 100 10 1 0.1 0.01 0.001 100 Inductance Characteristics 110% 100% 90% 80% 70% 60% 50% 40% 30% 20% 10 20% 40% 1108 BU-SB08798 vs 1000 B ...

Page 4

Solder Reflow Profile T P Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C Preheat A T smax T smin t s 25°C Time 25°C to Peak Reference JDEC J-STD-020D Profile Feature Preheat and Soak ...

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