120-5 Wakefield Thermal Solutions, 120-5 Datasheet - Page 4

• Manufacturer Part Number: 120-5
• Description: SILICON GREASE 5 OZ TUBE
• Manufacturer: Wakefield Thermal Solutions
• Series: 120r
• Type: Silicon Compoundr

Specifications of 120-5

• Size / Dimension: 5 oz Tube
• Dispensing Method: Tube
• Weight: 5oz
• Trade Name, Chemical: 120 Series
• Features: Excellent Thermal Resistance Of Only 0.05°C/W For A 0.001 In. Film With An Area Of One Square Inch.
• Color: White
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 345-1008

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
All other products, please contact factory for price, delivery, and minimums.
DeltaBond™ 155
DeltaBond™ 156
Accessory
Products
conditions of use being beyond our control.
* Since the hardener/resin reaction is exothermic, it is important that batch size be matched to hardener speed. Working times given are for approximate batch sizes: A—200 gms,
† After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties and should be room temperature aged or post-cured as shown to
‡ After initial cure, material may be brought to full physical and electrical properties during post-cure or may be room temperature aged for charted length of time to achieve same
The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer's own risk,
full properties.
B—200 gms. Larger batch sizes will greatly reduce working time.
achieve full physical and electrical properties.
DeItaBond™ 155 is an epoxy adhesive formulated for use within the semiconductor industry. An easy to mix spread
thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of thermal expansion comparable to
that of copper and aluminum. This adhesive is principally used to form thermally conductive joints in fabricated heat
sinks and between heat sinks and power devices. When used to bond semiconductors to heat sinks, it also serves
as an electrical insulator. Its strong bond to a wide variety of substrates resists severe temperature cycling.
DeItaBond™ 155 is only available in kit size. Simply squeeze out equal lengths and mix to uniform color. Shelf life:
1 year.
Typical Properties Fully Cured
(Btu) (in.)/(hr) (ft
Bond shear strength
Heat distortion point - °F
Minimum dielectric strength,
DeltaBond™ 156 Thermally Conductive Adhesive is a modified acrylic adhesive designed for permanent mounting
on components where heat must be effectively transmitted. Recommended for electromechanical assemblies to bond
components and dissipate heat, it replaces mechanical fasteners and compressible pads, silicone grease, and
epoxies; eliminates air entrapment, and other variables related to epoxy mixing. This soft paste requires no mixing
and flows easily to allow thin bond lines. Primer activated, cure begins upon assembly. DeltaBond™ Activator fixtures
at room temperature in less than 5 minutes. Full strength is developed in 4 to 12 hours and fillets become dry to the
touch in 24 hours. It is not recommended to use this durable adhesive without the use of DeltaBond™ Activator.
DeltaBond™ 156 is available in kit size; order 156-K (25 ml Syringe and Activator Kit). Shelf life: 1 year.
Tensile Shear
N o t e: The absolute thermal conductivity test was developed
specifically for measuring thermal properties of thin film adhesive bonds.
Thermal conductivity -
W/(m) (°K)
Thermal resistivity - (°C) (in.)watt
Max operation
Typical Properties Fully Cured
Temperature Range
Tensile Strength, at break
Modulus
Elongation, at break
Outgassing
Coefficient of Thermal Expansion
Thermal Conductivity, K
(absolute at 86° F (30° C)
v/mil, 0.125 in. sample
temp - °C
1 in. overlap - psi
etched aluminum to
etched aluminum
DeltaBond™ 156
Number
Characteristics
Model
Characteristics
Test
2
) (°F)
DELTABOND™155
Continuous
Intermittent
DELTABOND™156
125°F
212°F
77°F
Part No.
156-K
Results
-65 to 300°F
(-54 to 149° C)
300° F to (177° C)
Intermittent
2360 psi
233,000 psi
7.75%
2.5% TLM
0.05% CVCM
7.1 x 10e -4 ( c m / c m°C )
2500psi
3.47 Btu x in./hr ft
(0.50 W/m °C)
Resin Kit Hardener Syringe - 0.85 fl oz - 25 ml - 2 oz
net/0.44 oz fl contents bottle -12ml
DeltaBond™155
Hardener Type
0.836
2,600
130
400
100
5.8
47
—
—
65
Description
72
Resin
Ordering Guide - Resin and Hardener
2
° F
Container
D1002
ASTM
D638
D638
D638
E595
DELTABOND™156
Parts of hardener per 100 parts of resin
*Working Time - at 77°F
†Initial cure time
‡Post-cure time at a temp in °F
‡Alternate room temp. aging time at 77°F
Working consistency (77°F)
Working viscosity (77°F) cps
DeltaBond™ 155
Number
Model
N o t e: DeltaBond™ Thermally Conductive Adhesive-High Strength
contains a metallic filler which, in certain applications, may have
an effect on electrical properties. Therefore, test each particular
application to ensure that electrical properties are as required.
Dielectric Strength
D i e l e c t r i c Constant, 77°F (25°C)
Dissipaton Factor, 77°F (25°C)
Volume Resistivity
Surface Resistivity
Part No.
Mixing Proportions and Working Properties
77°F
150°F
155
250°F
Ordering Guide - Resin and Hardener
Test
1MM Hz
1MM Hz
1000 Hz
1000 Hz
100 Hz
100 Hz
Included in kit hardener with brush applicator - 4.2 oz
total wt/kt
Kit (3 oz resin, 3 oz hardener) Included in P/N 155
DELTABOND™154
DELTABOND™155
Typical Electrical Properties
Resin
DELTABOND™156
Container
Part Number
5.2x10e 11 (ohms-cm)
Hardener
8.6 x 10e 13 (ohms)
220 volts/mil
Results
14.92
14.26
12.34
0.03
0.05
0.06
by volume 100
4 hrs @ 200°F
Part Number
Hardener
D257
Normally stocked
90 min
45 min
20 min
4 days
D25
8 hrs
paste
paste
D150
D149
D150
ASTM
7