101800F00000G

Manufacturer Part Number101800F00000G
DescriptionTHERMAL GREASE
ManufacturerAavid Thermalloy
SeriesTherolink 1000
TypeGrease
101800F00000G datasheet
MSDS Material Safety Datasheet
 

Specifications of 101800F00000G

Size / Dimension2 oz TubeLead Free Status / RoHS StatusLead free / RoHS Compliant
Other names10  
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How to select a heat sink
The basic equation for heat transfer or power dissipation may be stated as follows:
Δ T
P D =
ΣR θ
Where:
P D = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣR θ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
T J –T A
P D =
P D =
R θJC + R θCS + R θSA
Where:
T J = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
T C = case temperature of the semiconductor device in °C.
T S = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
T A = ambient air temperature in °C.
R θJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
R θCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
R θSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
The above equations are generally used to determine the required thermal resistance of the heat sink (R θSA ),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
FIGURE 1
Mounting surface
(cooler/dissipator)
Interface
Junction
(heat source)
P
D
Semiconductor case
R
R
θCS
θSA
Heat flow path mounting
surface to ambient, equation (3)
T
S
R
Heat flow path case
θJC
to ambient equation (2)
T
C
Heat flow path junction
to ambient, equation (1)
T
J
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
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www.aavidthermalloy.com
How To Select a Heat Sink
T C –T A
P D =
R θCS + R θSA
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
FIGURE 2
Atmosphere
or ambient
T
A
T J
P
D
R θJC
T
A
ASIA
T S –T A
R θSA
T C
T S
T A
R θCS
R θSA
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