102100F00000G Aavid Thermalloy, 102100F00000G Datasheet - Page 25

• Manufacturer Part Number: 102100F00000G
• Description: THERMAL GREASE
• Manufacturer: Aavid Thermalloy
• Series: Therolink 1000r
• Type: Greaser

Specifications of 102100F00000G

• Size / Dimension: 16 oz Jar
• Product: Thermal Management
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 12

7109
5734
ORDERING INFORMATION
See below for tape and reel information
ORDERING INFORMATION
Surface mount heat sink for D
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Part Number
7109D/TRG
7109DG
Surface mount heat sink for D
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Part Number
573400D00010G
573400D00000G
See below for tape and reel information
ORDERING INFORMATION
Part Number
7106D/TRG
7109D/TRG
573100D00010G
573300D00010G
573400D00010G
www.aavidthermalloy.com
Surface mount heat sink for D
Surface mount heat sink for D
Tape and Reel information
Packaging
13" Reel, 125 per reel
Bulk, 500 per bag
Packaging
13" Reel, 250 per reel
Bulk, 500 per bag
44.00 (1.730)
44.00 (1.730)
44.00 (1.730)
44.00 (1.730)
44.00 (1.730)
“A” Dim
2
3
AMERICA
PAK
PAK
EUROPE
40.40 (1.590)
40.40 (1.590)
40.40 (1.590)
40.40 (1.590)
40.40 (1.590)
“B” Dim
Italy Tel: [phone] email: [e-mail]
United Kingdom Tel: [phone] email: [e-mail]
USA Tel: [phone] email: [e-mail]
2
3
PAK (TO-263) package semiconductors
PAK (TO-268) package semiconductors
24.00 (0.940)
36.00 (1.420)
16.00 (0.630)
24.00 (0.940)
24.00 (0.940)
100
50
40
30
20
10
“C” Dim
80
60
40
20
0
0
0.0
0
0
0
200
200
0.5
1
Air Velocity—Feet Per Minute
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Heat Dissipated—Watts
400
1.0
400
2
4.06 (0.160)
4.06 (0.160)
4.06 (0.160)
4.06 (0.160)
4.06 (0.160)
“D” Dim
1.5
600
600
3
800
2.0
800
4
1000
1000
2.5
5
20
16
12
0
5
0
8
4
4
3
2
1
ASIA
Singapore Tel: [phone] email: [e-mail]
Taiwan Tel: [phone] email: [e-mail]
A
B
Refer to Figure A and B on page 26 for board footprint information
(0.500)
(0.400)
12.70
10.16
Refer to Figure D on page 26 for board footprint information
(0.05)
1.3
SMT
(1.220)
(0.690)
(1.000)
(0.600)
(0.450)
30.99
17.53
15.24
25.40
11.43
Material: 0.63 (0.025) Thick Copper
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Finish: Tin Plated
C
(0.763)
19.38
(0.450)
11.43
(0.290)
7.37
D
25