658-35AB Wakefield Thermal Solutions, 658-35AB Datasheet

HEATSINK CPU 28MM SQBLK W/O TAPE

658-35AB

Manufacturer Part Number
658-35AB
Description
HEATSINK CPU 28MM SQBLK W/O TAPE
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet

Specifications of 658-35AB

Height
0.35" (9mm)
Color
Black
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
27.94mm x 27.94mm
Power Dissipation @ Temperature Rise
2W @ 50°C
Thermal Resistance @ Forced Air Flow
8.0°C/W @ 200 LFM
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 8.89 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Packages Cooled
BGA / LED
Width
27.9mm
Length
27.9mm
Mounting Type
Adhesive
Package / Case
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1066

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
658-35AB
Manufacturer:
WAK
Quantity:
664
Part Number:
658-35ABT5
Manufacturer:
WAK
Quantity:
34
THERMAL INTERFACE MATERIAL PART NUMBER GUIDE
Ö
“T” SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES
“S” SERIES THERMAL INTERFACE PADS
ORDERING INFORMATION

Related parts for 658-35AB

658-35AB Summary of contents

Page 1

THERMAL INTERFACE MATERIAL PART NUMBER GUIDE “T” SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES “S” SERIES THERMAL INTERFACE PADS ORDERING INFORMATION Ö ...

Page 2

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs PRODUCT FEATURES 30 624-25-T4 624-35-T4 25 624-45-T4 624-60- 200 300 400 500 Approach Velocity, LFM PRODUCT FEATURES 20 18 625-25-T4 625-25-T4 16 625-45-T4 625-60- ...

Page 3

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Notes: Notes: Notes: ...

Page 4

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Notes: PRODUCT FEATURES 14 642-25-T4 642-35-T4 12 642-45-T4 642-60- 200 300 400 500 Approach Velocity, LFM Performance shown is with T4 thermal adhesive applied. 600 ...

Page 5

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Notes: Notes ...

Page 6

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Notes: PRODUCT FEATURES ...

Page 7

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 2. Optional factory preapplied pressure-sensitive adhesive. See Page 3 PRODUCT FEATURES 919541 Series Heat Sink Thermal Performance 100 200 ...

Page 8

DELTEM ™ COMPOSITE HEAT SINKS FOR BGAs Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 AIR VELOCITY (LFM) 0 200 400 600 ...

Page 9

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 2.808 “A” DIM. Designed to fit a .063” thick PCB electronic package thickness of .110” See 609 Series for PCB hole layout for clip attachment Thermal Interface Material Option 619 95 ...

Page 10

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 500 600 700 AIR VELOCITY (LFM 100 ...

Page 11

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 100 200 300 400 500 600 ...

Page 12

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 100 200 300 ...

Page 13

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 500 600 700 AIR VELOCITY (LFM 100 200 300 400 500 600 700 AIR VELOCITY ...

Page 14

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 AIR VELOCITY (LFM 100 200 300 AIR VELOCITY (LFM ...

Page 15

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 AIR VELOCITY (LFM 500 600 700 100 ...

Page 16

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 500 AIR VELOCITY (LFM 100 200 300 400 500 AIR VELOCITY (LFM ...

Page 17

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 AIR VELOCITY (LFM 100 200 300 400 AIR VELOCITY (LFM ...

Page 18

OPTIONAL THERMAL INTERFACE ROCKER CLIP OPTION SPRING CLIP OPTION (SEE PRODUCT DES.) (SEE PRODUCT DES.) .42 1.00 1.50 .23 1.50 2.68 MODEL NUMBER PAD (SEE PRODUCT DES.) HEIGHT 100 = 1.00" 569 - 100 THERMAL INTERFACE ...

Page 19

PGA SPGA v ...

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