D10650-40 Wakefield Thermal Solutions, D10650-40 Datasheet

HEATSINK 100PQFP COMPOSITE

D10650-40

Manufacturer Part Number
D10650-40
Description
HEATSINK 100PQFP COMPOSITE
Manufacturer
Wakefield Thermal Solutions
Datasheet

Specifications of D10650-40

Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
16.51mm x 16.51mm
Height
0.4" (10.16mm)
Power Dissipation @ Temperature Rise
2W @ 40°C
Thermal Resistance @ Forced Air Flow
25°C/W @ 350 LFM
Product
Heatsinks
Mounting Style
Through Hole
Heatsink Material
Plastic
Fin Style
Pin
Dimensions
16.51 mm L x 10.16 mm W x 16.51 mm H
Designed For
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1076
D1065040
THERMAL INTERFACE MATERIAL PART NUMBER GUIDE
Ö
“T” SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES
“S” SERIES THERMAL INTERFACE PADS
ORDERING INFORMATION

Related parts for D10650-40

D10650-40 Summary of contents

Page 1

THERMAL INTERFACE MATERIAL PART NUMBER GUIDE “T” SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES “S” SERIES THERMAL INTERFACE PADS ORDERING INFORMATION Ö ...

Page 2

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs PRODUCT FEATURES 30 624-25-T4 624-35-T4 25 624-45-T4 624-60- 200 300 400 500 Approach Velocity, LFM PRODUCT FEATURES 20 18 625-25-T4 625-25-T4 16 625-45-T4 625-60- ...

Page 3

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Notes: Notes: Notes: ...

Page 4

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Notes: PRODUCT FEATURES 14 642-25-T4 642-35-T4 12 642-45-T4 642-60- 200 300 400 500 Approach Velocity, LFM Performance shown is with T4 thermal adhesive applied. 600 ...

Page 5

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Notes: Notes ...

Page 6

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs Notes: PRODUCT FEATURES ...

Page 7

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 2. Optional factory preapplied pressure-sensitive adhesive. See Page 3 PRODUCT FEATURES 919541 Series Heat Sink Thermal Performance 100 200 ...

Page 8

DELTEM ™ COMPOSITE HEAT SINKS FOR BGAs Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 Available with pressure sensitive adhesives for quick and easy mounting. See Page 3 AIR VELOCITY (LFM) 0 200 400 600 ...

Page 9

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 2.808 “A” DIM. Designed to fit a .063” thick PCB electronic package thickness of .110” See 609 Series for PCB hole layout for clip attachment Thermal Interface Material Option 619 95 ...

Page 10

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 500 600 700 AIR VELOCITY (LFM 100 ...

Page 11

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 100 200 300 400 500 600 ...

Page 12

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 100 200 300 ...

Page 13

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 500 600 700 AIR VELOCITY (LFM 100 200 300 400 500 600 700 AIR VELOCITY ...

Page 14

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 AIR VELOCITY (LFM 100 200 300 AIR VELOCITY (LFM ...

Page 15

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 AIR VELOCITY (LFM 500 600 700 100 ...

Page 16

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 500 AIR VELOCITY (LFM 100 200 300 400 500 AIR VELOCITY (LFM ...

Page 17

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs 100 200 300 400 AIR VELOCITY (LFM 100 200 300 400 AIR VELOCITY (LFM ...

Page 18

OPTIONAL THERMAL INTERFACE ROCKER CLIP OPTION SPRING CLIP OPTION (SEE PRODUCT DES.) (SEE PRODUCT DES.) .42 1.00 1.50 .23 1.50 2.68 MODEL NUMBER PAD (SEE PRODUCT DES.) HEIGHT 100 = 1.00" 569 - 100 THERMAL INTERFACE ...

Page 19

PGA SPGA v ...

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