LTN20069-T5 Wakefield Thermal Solutions, LTN20069-T5 Datasheet

Manufacturer Part Number

LTN20069-T5

Description

HEAT SINK BGA/PGA 16.5X16.5X8.9

Manufacturer

Wakefield Thermal Solutions

Datasheet

1.LTN20069-T5.pdf (1 pages)

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method

Thermal Tape, Adhesive (Included)

Outline

16.51mm x 16.51mm

Height

0.35" (9mm)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

Thermal Resistance @ Forced Air Flow

Thermal Resistance @ Natural

Other names

345-1101
LTN20069
LTN20069-T5