630-60AB Wakefield Thermal Solutions
630-60AB
Manufacturer Part Number
630-60AB
Description
HEATSINK FOR BGA 35MM
Manufacturer
Wakefield Thermal Solutions
Series
630r
Specifications of 630-60AB
Height
0.600" (15.20mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
35.00mm x 35.00mm
Packages Cooled
BGA
Width
35mm
Heat Sink Material
Aluminum
Length
35mm
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q1985056
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