MHSL10025 Lineage Power, MHSL10025 Datasheet

MHSL10025

Manufacturer Part Number

MHSL10025

Description

HEATSINK 2.28L X.84"H EXTRUSION

Manufacturer

Lineage Power

Datasheet

1.MHSL02525.pdf (8 pages)

Specifications of MHSL10025

Attachment Method

Bolt On

Outline

57.91mm x 36.83mm

Height

0.84" (21.33mm)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Package Cooled

Power Dissipation @ Temperature Rise

Thermal Resistance @ Forced Air Flow

Thermal Resistance @ Natural

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Technical Note

July 1996

Introduction

Board-mounted power modules (BMPMs) enhance

the capabilities of advanced computer and communi-

cations systems by providing ﬂexible power architec-

tures; however, proper cooling of the power modules

is required for reliable and consistent operation.

Maintaining the operating case temperature (Tc)

within the speciﬁed range keeps internal component

temperatures within their speciﬁcations. This, in turn,

helps keep the expected mean time between failures

(MTBF) from falling below the speciﬁed rating.

Tyco's FC- and FW- Series 250 W to 300 W BMPMs

are designed with high efﬁciency as a primary goal.

The 5 V output units have typical full load efﬁciencies

of 83%, which result in less heat dissipation and

lower operating temperatures. Also, these modules

use temperature resistant components, such as

ceramic capacitors, that do not exhibit wearout

behavior during prolonged exposure to high tempera-

tures, as do aluminum electrolytic capacitors.

This application note provides the necessary infor-

mation to verify that adequate cooling is present in a

given operating environment. This information is

applicable to all Tyco 250 W to 300 W BMPMs in the

4.6 in. x 2.4 in. x 0.5 in. package.

250 W—300 W Board-Mounted Power Modules

Thermal Management for FC- and FW-Series

Basic Thermal Management

Proper cooling can be veriﬁed by measuring the case

temperature of the module (Tc) at the location indi-

cated in Figure 1. Note that the view in Figure 1 is of

the metal surface of the module (the pin locations

shown are for reference). Tc must not exceed 100 °C

while operating in the ﬁnal system conﬁguration.

After the module has reached thermal equilibrium,

the measurement can be made with a thermocouple

or surface probe. If a heat sink is mounted to the

case, make the measurement as close as possible to

the indicated position, taking into account the contact

resistance between the mounting surface and the

heat sink (see Heat Sink section).

While this is a valid method of checking for proper

thermal management, it it is only usable if the ﬁnal

system conﬁguration exists and can be used as a

test environment. The graphs on the accompanying

pages provide guidelines to predict the thermal per-

formance of the module for typical conﬁgurations that

include heat sinks in natural or forced airﬂow environ-

ments. However, due to differences between the test

setup and the ﬁnal system environment, the module

case temperature must always be checked in the

ﬁnal system conﬁguration to verify proper operation.

Figure 1. Case Temperature Measurement (Metal

1.20 (30.5)

Side)

ON/OFF

SYNC IN

SYNC OUT

CASE

(+)

(–)

TEMPERATURE HERE

3.25 (82.6)

MEASURE CASE

(+)

(–)

8-1303a

Related parts for MHSL10025

MHSL10025 Summary of contents

Page 1

Technical Note July 1996 250 W—300 W Board-Mounted Power Modules Introduction Board-mounted power modules (BMPMs) enhance the capabilities of advanced computer and communi- cations systems by providing ﬂexible power architec- tures; however, proper cooling of the power modules is required ...

Page 2

Thermal Management for FC- and FW-Series 250 W—300 W Board-Mounted Power Modules Basic Thermal Management The goal of thermal management is to transfer the heat dissipated by the module to the surrounding environ- ment. The amount of power dissipated by ...

Page 3

Technical Note July 1996 Module Derating (continued) Convection Without Heat Sinks Increasing airﬂow over the module enhances heat transfer via convection. Figures 4 and 5 show the maxi- mum power that can be dissipated by the module with- out exceeding ...

Page 4

Thermal Management for FC- and FW-Series 250 W—300 W Board-Mounted Power Modules Module Derating (continued) Heat Sink Conﬁguration Several standard heat sinks are available for the FC- and FW-Series 250 W—300 W BMPMs, as shown in Figures 6 and 7. ...

Page 5

Technical Note July 1996 Module Derating (continued) Heat Sink Conﬁguration (continued) 4.56 Nomenclature for this family of heat sinks is as follows: where ﬁn orientation; longitudinal (L) or transverse (T) yyy = heat sink height (in 100ths of ...

Page 6

Thermal Management for FC- and FW-Series 250 W—300 W Board-Mounted Power Modules Module Derating (continued) Natural Convection With Heat Sinks Figures 8 and 9 show the power derating for a module in natural convection with the heat sinks shown in ...

Page 7

Technical Note July 1996 Basic Thermal Model Another approach for analyzing thermal performance is to model the overall thermal resistance of the module. This presentation method is especially useful when considering heat sinks, since their performance is also typically given ...

Page 8

Thermal Management for FC- and FW-Series 250 W—300 W Board-Mounted Power Modules Basic Thermal Model (continued) Figures 11 and 12 can be used to determine thermal performance under various airﬂow and heat sink con- ﬁgurations as shown in the following ...

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