MHSL10055 Lineage Power, MHSL10055 Datasheet
MHSL10055
Specifications of MHSL10055
Related parts for MHSL10055
MHSL10055 Summary of contents
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Technical Note July 1996 250 W—300 W Board-Mounted Power Modules Introduction Board-mounted power modules (BMPMs) enhance the capabilities of advanced computer and communi- cations systems by providing flexible power architec- tures; however, proper cooling of the power modules is required ...
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Thermal Management for FC- and FW-Series 250 W—300 W Board-Mounted Power Modules Basic Thermal Management The goal of thermal management is to transfer the heat dissipated by the module to the surrounding environ- ment. The amount of power dissipated by ...
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Technical Note July 1996 Module Derating (continued) Convection Without Heat Sinks Increasing airflow over the module enhances heat transfer via convection. Figures 4 and 5 show the maxi- mum power that can be dissipated by the module with- out exceeding ...
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... All heat sink curve data taken had such a dry pad present. 2.36 4 4.56 Figure 6. Heat Sinks with Longitudinal Fins Technical Note 1/4 IN. (MHSL02555) 1/2 IN. (MHSL05055) 1 IN. (MHSL10055) 1 1/2 IN. (MHSL15055) Tyco Electronics Corp. July 1996 8-1316 ...
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Technical Note July 1996 Module Derating (continued) Heat Sink Configuration (continued) 4.56 Nomenclature for this family of heat sinks is as follows: where fin orientation; longitudinal (L) or transverse (T) yyy = heat sink height (in 100ths of ...
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Thermal Management for FC- and FW-Series 250 W—300 W Board-Mounted Power Modules Module Derating (continued) Natural Convection With Heat Sinks Figures 8 and 9 show the power derating for a module in natural convection with the heat sinks shown in ...
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Technical Note July 1996 Basic Thermal Model Another approach for analyzing thermal performance is to model the overall thermal resistance of the module. This presentation method is especially useful when considering heat sinks, since their performance is also typically given ...
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Thermal Management for FC- and FW-Series 250 W—300 W Board-Mounted Power Modules Basic Thermal Model (continued) Figures 11 and 12 can be used to determine thermal performance under various airflow and heat sink con- figurations as shown in the following ...