PELTIER MODULE CP08,31,06

71035-505

Manufacturer Part Number71035-505
DescriptionPELTIER MODULE CP08,31,06
ManufacturerLaird Technologies
SeriesCP
TypeCeramic Plate
71035-505 datasheet
 


Specifications of 71035-505

Mfg Application NotesThermoelectric HandbookOutline L X W X H12.29mm x 12.29mm x 3.40mm
Qmax @ Th4.5W @ 25°CCurrent - Max2.1A
Voltage - Max3.7VResistance (ohms)1.54
Delta Tmax @ Th67°C @ 25°CResistance In Ohms1.54
Cooling Power4.4 WMax Heat Load+ 67 C
Maximum Current2.1 AMaximum Voltage3.8 V
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names926-1016
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Innovative Technology
for a Connected World
global
solutions:
local
support
TM
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
clv.customerpos@lairdtech.com
www.lairdtech.com
Ceramic Plate Series CP08,31,06
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered
‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable TEMs is available
in numerous heat pumping capacities, geometric shapes, and input power ranges.
Assembled with Bismuth Telluride semiconductor material and thermally conductive
Aluminum Oxide ceramics, the CP Series is designed for higher current and large
heat-pumping applications.
Features
• Precise Temperature Control
• Compact Geometric Sizes
• Reliable Solid State Operation
• No Sound or Vibration
• Environmentally Friendly
• DC Operation
• RoHS Compliant
Performance Specifications
Hot Side Temperature (°C)
25°C
Qmax (Watts)
4.5
Delta Tmax (°C)
67
Imax (Amps)
2.1
Vmax (Volts)
3.7
Module Resistance (Ohms)
1.54
Suffix
Thickness
Flatness &
(prior to Tinning)
Parallelism
L
0.134”± 0.010”
0.0015” / 0.0015”
L1
0.134”± 0.001”
0.001” / 0.001”
L2
0.134”± 0.0005”
0.0005” / 0.0005”
ML
0.138”± 0.010”
0.002” / 0.002”
LM
0.138”± 0.010”
0.002” / 0.002”
MM
0.142”± 0.010”
0.002” / 0.002”
Sealing Option
Suffix
Sealant
Color
Temp Range
RT
RTV
White
-60 to 204 °C
EP
Epoxy
Black
-55 to 150 °C
Applications
• Medical Lasers
• Lab Science Instrumentation
• Clinical Diagnostic Systems
• Photonics Laser Systems
• Electronic Enclosure Cooling
• Food & Beverage Cooling
• Chillers (Liquid Cooling)
50°C
4.9
75
2.1
4.0
1.74
Hot Face
Cold Face
Lead Length
Lapped
Lapped
4.5”
Lapped
Lapped
4.5”
Lapped
Lapped
4.5”
Metallized
Lapped
4.5”
Lapped
Metallized
4.5”
Metallized
Metallized
4.5”
Description
Non-corrosive, silicone adhesive sealant
Low desity syntactic foam epoxy encapsulant

71035-505 Summary of contents

  • Page 1

    Innovative Technology for a Connected World global solutions: local support TM Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 clv.customerpos@lairdtech.com www.lairdtech.com Ceramic Plate Series CP08,31,06 Thermoelectric Modules The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered ‘the standard’ in the thermoelectric industry. This broad product line of high-performance and highly reliable TEMs is available in numerous heat pumping capacities, geometric shapes, and input power ranges. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the CP Series is designed for higher current and large heat-pumping applications. Features • Precise Temperature Control • Compact Geometric Sizes • Reliable Solid State Operation ...

  • Page 2

    ... Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request ...