TJA1055T/3/C NXP Semiconductors, TJA1055T/3/C Datasheet
TJA1055T/3/C
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TJA1055T/3/C Summary of contents
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... General description The TJA1055 is the interface between the protocol controller and the physical bus wires in a Controller Area Network (CAN primarily intended for low-speed applications up to 125 kBd in passenger cars. The device provides differential receive and transmit capability but will switch to single-wire transmitter and/or receiver in error conditions. The TJA1055 is the enhanced version of the TJA1054 and TJA1054A ...
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... NXP Semiconductors I Automatic reset to differential mode if bus failure is removed I Full wake-up capability during failure modes 2.3 Protections I Bus pins short-circuit safe to battery and to ground I Thermally protected I Bus lines protected against transients in an automotive environment I An unpowered node does not disturb the bus lines ...
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... NXP Semiconductors 4. Ordering information Table 2. Ordering information Type number Package Name TJA1055T SO14 TJA1055T/3 5. Block diagram 1 INH 7 WAKE 5 STB TIMER TXD (1) ( ERR ( RXD 13 GND (1) For TJA1055T/3 current source to GND; for TJA1055T pull-up resistor to V (2) Not within TJA1055T/3. Fig 1. Block diagram TJA1055_4 ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. 6.2 Pin description Table 3. Symbol INH TXD RXD ERR STB EN WAKE RTH RTL V CC CANH CANL GND BAT TJA1055_4 Product data sheet INH 1 2 TXD RXD 3 ERR 4 5 STB EN 6 WAKE 7 Pin configuration ...
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... NXP Semiconductors 7. Functional description The TJA1055 is the interface between the CAN protocol controller and the physical wires of the CAN bus (see applications 125 kBd, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller. ...
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... NXP Semiconductors Table 4. Failure [1] A weak termination implies a pull-down current source behavior typical. [2] A weak termination implies a pull-up current source behavior typical. Failure 6 is detected if the CANL bus line exceeds its comparator threshold for a certain period of time. This delay is needed to avoid false triggering by external RF fields. After detection of failure 6, the reception is switched to the single-wire mode through CANH ...
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... NXP Semiconductors 7.2 Low power modes The transceiver provides three low power modes which can be entered and exited via STB and EN (see The sleep mode is the mode with the lowest power consumption. Pin INH is switched to HIGH-impedance for deactivation of the external voltage regulator. Pin CANL is biased to the battery voltage via pin RTL ...
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... NXP Semiconductors A local wake-up through pin WAKE is detected by a rising or falling edge with a consecutive level exceeding the maximum specifi wake-up request the transceiver will set the output on pin INH to HIGH which can be used to activate the external supply voltage regulator. A wake-up request is signalled on ERR or RXD with an active LOW signal. So the external microcontroller can activate the transceiver (switch to normal operating mode) via pins STB and EN ...
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... NXP Semiconductors (1) Mode change via input pins STB and EN. (2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is (3) Pin INH is activated and pins RXD and ERR are pulled LOW after wake-up via bus or input (4) Transitions to normal mode clear the internal wake-up: wake-up interrupt fl ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CANL V trt(n) V I(WAKE) I I(WAKE) V INH V RTH V RTL R RTH R RTL stg V esd [1] All voltages are defined with respect to pin GND, unless otherwise specified. Positive current flows into the device ...
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... NXP Semiconductors 9. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-s) 10. Static characteristics Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter Supplies (pins V and BAT supply voltage CC V supply voltage for forced CC(stb) ...
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... NXP Semiconductors Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter I total supply current sup(tot) Pins STB, EN and TXD V HIGH-level input voltage IH V LOW-level input voltage IL I HIGH-level input current IH pins STB and EN ...
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... NXP Semiconductors Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter Pins CANH and CANL V differential receiver th(dif) threshold voltage V recessive output voltage O(reces) on pin CANH on pin CANL V dominant output voltage ...
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... NXP Semiconductors Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter R single-ended input i(se)(CANL) resistance on pin CANL R differential input i(dif) resistance Pins RTH and RTL R switch-on resistance on sw(RTL) pin RTL ...
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... NXP Semiconductors Table 9. Dynamic characteristics BAT ground; unless otherwise specified. Symbol Parameter t propagation delay TXD (HIGH) to PD(H) RXD (HIGH) t delay time to sleep d(sleep) t disable time of TxD permanent dis(TxD) dominant timer t dominant time on pin CANH dom(CANH) t dominant time on pin CANL ...
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... NXP Semiconductors V TXD V CANL V CANH V CAN V RXD Fig 4. 12. Test information Fig 5. TJA1055_4 Product data sheet t PD( CAN CANH CANL Timing diagram for dynamic characteristics BAT INH BAT WAKE 7 TXD TXD 2 12 STB TJA1055T RXD RXD GND ERR rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns. ...
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... NXP Semiconductors V BAT TXD Fig 6. Fig 7. TJA1055_4 Product data sheet = INH BAT WAKE 7 TXD 2 3.3 V STB TJA1055T 2.5 k RXD RXD GND ERR rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns. TXD Termination resistors R and R CAN_L CAN_H testing purposes because the minimum load allowed on the CAN bus lines is 500 transceiver ...
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... NXP Semiconductors Fig 8. Fig 9. TJA1055_4 Product data sheet INH BAT 1 14 WAKE 7 TXD 2 STB 3.3 V TJA1055T 2.5 k RXD GND ERR The waveforms of the applied transients on pins CANH and CANL will be in accordance with “ISO 7637 part 1” : test pulses and 3b. ...
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... NXP Semiconductors Fig 10. Application diagram (TJA1055T/3) 12.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1055_4 Product data sheet 3 V CAN CONTROLLER CTX0 CRX0 Px.x TXD ...
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... NXP Semiconductors 13. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.01 0.069 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 12. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 15. Appendix 15.1 Overview of differences between the TJA1055 and the TJA1054A Table 12. Limiting values Symbol ...
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... NXP Semiconductors 16. Revision history Table 13. Revision history Document ID Release date TJA1055_4 20090217 • Modifications: No technical content change; data sheet release date updated TJA1055_3 20070313 TJA1055_2 20061030 TJA1055_1 20060801 (9397 750 14908) TJA1055_4 Product data sheet Enhanced fault-tolerant CAN transceiver Data sheet status ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 Optimized for in-car low-speed communication . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Bus failure management 2.3 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.4 Support for low power modes . . . . . . . . . . . . . . 2 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description ...