TXC-06880BIOG Transwitch Corporation, TXC-06880BIOG Datasheet - Page 116

• Manufacturer Part Number: TXC-06880BIOG
• Manufacturer: Transwitch Corporation

Specifications of TXC-06880BIOG

• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Envoy-CE2 Device
DATA SHEET
TXC-06880
1 1 6 o f 1 2 2
The Envoy-CE2 device is packaged in a 27 mm × 27 mm, 580-Lead Plastic Ball Grid Array
(PBGA) package with a 1.0 mm pitch, as illustrated in
A3
D D2
Notes:
1. All dimensions are in millimeters.
2. Identification of the solder ball A1
3. Size of array: 26 x 26, JEDEC code
A2
Values shown are for reference only.
corner is contained within this
shaded zone. This package corner
may be a 90° angle, or chamfered for
A1 identification.
MO-151.
E1/4
TRANSWITCH
TXC-06880BROG
TXC-06880BIOG
D1/4
Figure 25. Envoy-CE2 Package Diagram
E2
E
Note 2
P
ACKAGE
Dimension (Note 1)
A
0.50 R, 3 Places
-D1-
A3 (Nom)
D1 (Nom)
E1 (Nom)
A (Nom)
A1
b (Ref.)
e (Ref.)
A1
A2
D2
E2
Figure 25.
D
E
AF
AE
AD
AC
AB
AA Y W V
PRELIMINARY TXC-06880-MB, Ed. 4
I
NFORMATION
Bottom View
U
T
23.95
23.95
R
1.12
-E1-
0.4
P N M
Nominal
L
K J H
2.23
0.56
0.63
27.0
25.0
27.0
25.0
1.0
G F E D
24.35
24.35
1.22
February 2005
0.6
C B
A
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
10
11
9
8
7
6
5
4
3
2
1
b
e