FERRITE CHIP BEAD 1500 OHM SMD

MMZ1608A152E

Manufacturer Part NumberMMZ1608A152E
DescriptionFERRITE CHIP BEAD 1500 OHM SMD
ManufacturerTDK Corporation
SeriesMMZ
MMZ1608A152E datasheet
 

Specifications of MMZ1608A152E

Package / Case0603 (1608 Metric)Impedance @ Frequency1.5K Ohm @ 100MHz
Current Rating300mADc Resistance (dcr)1.000 Ohm Max
Filter TypeDifferential Mode - SingleNumber Of Lines1
Mounting TypeSurface MountShieldingUnshielded
Test Frequency100 MHzProductChip Ferrite Beads
Impedance1000 OhmsTolerance25 %
Maximum Dc Current300 mAmpsMaximum Dc Resistance1 Ohms
Operating Temperature Range- 55 C to + 125 CTermination StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names445-2178-2
MMZ1608A152ET
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Chip Beads(SMD)
For Signal Line
MMZ Series MMZ1608 Type
FEATURES
• Chip bead(impeder), MMZ series offers 7 construction materials.
• Size standardized for use by automatic assembly equipment.
No preferred orientation.
• Either flow or reflow soldering methods can be used due to
electroplating of the terminal electrodes.
• High reliability due to an entirely monolithic structure.
• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
• Low DC resistance structure of electrode prevents wasteful
electric power consumption.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
MMZ 1608 R 121 A
T
(1)
(2)
(3) (4) (5) (6)
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
Conformity to RoHS Directive
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
1.6±0.15
0.6
0.8
0.6
0.3±0.2
Thickness ( T )
Weight
3mg
0.6±0.15mm
4mg
0.8±0.15mm
TEMPERATURE RANGES
Operating/storage
–55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Quantity
Taping
4000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
Natural
cooling
230˚C
180˚C
150˚C
Preheating
Soldering
60 to 120s
30 to 60s
Time(s)
012-01 / 20100324 / e9412_mmz1608.fm
(1/8)
Dimensions in mm

MMZ1608A152E Summary of contents

  • Page 1

    Chip Beads(SMD) For Signal Line MMZ Series MMZ1608 Type FEATURES • Chip bead(impeder), MMZ series offers 7 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be ...

  • Page 2

    MATERIAL CHARACTERISTICS B material: This type is perfectly suited for fast digital signals. By equalizing R components and X components that beads possess at a frequency of 5MHz able to suppress overshooting, undershooting and ringing of fast digital ...

  • Page 3

    TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MMZ1608B121C 200 150 Z 100 100 1000 10000 Frequency ( MHz ) MMZ1608B471A 600 500 400 Z 300 R 200 100 100 ...

  • Page 4

    TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MMZ1608R601A 1000 800 600 Z 400 R 200 100 1000 10000 Frequency ( MHz ) MMZ1608S800A 120 100 ...

  • Page 5

    TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MMZ1608Y150B 100 1000 10000 Frequency ( MHz ) MMZ1608Y121B 300 250 200 Z 150 R 100 ...

  • Page 6

    TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MMZ1608A182B 2000 Z 1500 R 1000 X 500 100 1000 10000 Frequency ( MHz ) MMZ1608Q121B 400 300 Z R 200 X 100 100 1000 ...

  • Page 7

    TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MMZ1608D500C 400 300 Z R 200 X 100 100 1000 10000 Frequency ( MHz ) MMZ1608D121C 800 700 600 Z 500 R 400 300 200 X 100 0 ...

  • Page 8

    PACKAGING STYLES REEL DIMENSIONS 1.0 2.0±0.5 ø13±0.2 ø21±0.8 ø180±2.0 TAPE DIMENSIONS +0.1 Sprocket hole 1.5 –0.0 1.1max. 1.1±0.2 4.0±0.1 2.0±0.05 160min. Taping 200min. Drawing direction • All specifications are subject to change without notice. +2.0 8.4 –0.0 14.4max. Dimensions in ...