MCP1700T-2302E/MB Microchip Technology, MCP1700T-2302E/MB Datasheet

250mA CMOS LDO, Isupply 1uA And 2% Vout Accuracy 3 SOT-89 T/R

MCP1700T-2302E/MB

Manufacturer Part Number
MCP1700T-2302E/MB
Description
250mA CMOS LDO, Isupply 1uA And 2% Vout Accuracy 3 SOT-89 T/R
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP1700T-2302E/MB

Regulator Topology
Positive Fixed
Voltage - Output
2.3V
Voltage - Input
Up to 6V
Voltage - Dropout (typical)
0.15V @ 200mA
Number Of Regulators
1
Current - Output
200mA (Min)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
TO-243AA
Input Voltage Max
6.5 V
Output Voltage
2.3 V
Dropout Voltage (max)
350 mV
Output Current
250 mA
Load Regulation
1 %
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP1700T-2302E/MB
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Features
• 1.6 µA Typical Quiescent Current
• Input Operating Voltage Range: 2.3V to 6.0V
• Output Voltage Range: 1.2V to 5.0V
• 250 mA Output Current for output voltages ≥ 2.5V
• 200 mA Output Current for output voltages < 2.5V
• Low Dropout (LDO) voltage
• 0.4% Typical Output Voltage Tolerance
• Standard Output Voltage Options:
• Stable with 1.0 µF Ceramic Output capacitor
• Short Circuit Protection
• Overtemperature Protection
Applications
• Battery-powered Devices
• Battery-powered Alarm Circuits
• Smoke Detectors
• CO
• Pagers and Cellular Phones
• Smart Battery Packs
• Low Quiescent Current Voltage Reference
• PDAs
• Digital Cameras
• Microcontroller Power
Related Literature
• AN765, “Using Microchip’s Micropower LDOs”,
• AN766, “Pin-Compatible CMOS Upgrades to
• AN792, “A Method to Determine How Much
© 2007 Microchip Technology Inc.
- 178 mV typical @ 250 mA for V
- 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
DS00765, Microchip Technology Inc., 2002
BiPolar LDOs”, DS00766,
Microchip Technology Inc., 2002
Power a SOT23 Can Dissipate in an Application”,
DS00792, Microchip Technology Inc., 2001
2
Detectors
Low Quiescent Current LDO
OUT
= 2.8V
General Description
The MCP1700 is a family of CMOS low dropout (LDO)
voltage regulators that can deliver up to 250 mA of
current while consuming only 1.6 µA of quiescent
current (typical). The input operating range is specified
from 2.3V to 6.0V, making it an ideal choice for two and
three primary cell battery-powered applications, as well
as single cell Li-Ion-powered applications.
The MCP1700 is capable of delivering 250 mA with
only 178 mV of input to output voltage differential
(V
MCP1700 is typically ±0.4% at +25°C and ±3%
maximum over the operating junction temperature
range of -40°C to +125°C.
Output voltages available for the MCP1700 range from
1.2V to 5.0V. The LDO output is stable when using only
1 µF output capacitance. Ceramic, tantalum or
aluminum electrolytic capacitors can all be used for
input and output. Overcurrent limit and overtemperature
shutdown provide a robust solution for any application.
Package options include the SOT-23, SOT-89 and
TO-92.
Package Types
3-Pin SOT-23
OUT
GND V
MCP1700
1
= 2.8V). The output voltage tolerance of the
V
3
IN
OUT
2
MCP1700
3-Pin SOT-89
GND
1
MCP1700
V
V
2
IN
IN
V
OUT
3
DS21826B-page 1
GND V
3-Pin TO-92
MCP1700
1
2
IN
3
V
OUT

Related parts for MCP1700T-2302E/MB

MCP1700T-2302E/MB Summary of contents

Page 1

... BiPolar LDOs”, DS00766, Microchip Technology Inc., 2002 • AN792, “A Method to Determine How Much Power a SOT23 Can Dissipate in an Application”, DS00792, Microchip Technology Inc., 2001 © 2007 Microchip Technology Inc. MCP1700 General Description The MCP1700 is a family of CMOS low dropout (LDO) voltage regulators that can deliver up to 250 mA of current while consuming only 1.6 µ ...

Page 2

... MCP1700 Functional Block Diagrams V IN Over Current Over Temperature Typical Application Circuits V OUT 1.8V I OUT 150 mA DS21826B-page 2 MCP1700 Error Amplifier +V IN Voltage - Reference + GND MCP1700 V GND IN (2.3V to 3.2V OUT C OUT 1 µF Ceramic V OUT µF Ceramic © 2007 Microchip Technology Inc. ...

Page 3

... Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. © 2007 Microchip Technology Inc. † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is ...

Page 4

... Exceeding the maximum allowable power = 100 µ LOAD Conditions °C °C °C Minimum Trace Width Single Layer °C/W Board °C/W Typical FR4 4-layer Application °C/W Typical, 1 square inch of copper EIA/JEDEC JESD51-751-7 °C/W 4-Layer Board ). Exceeding the maximum allowable power © 2007 Microchip Technology Inc. ...

Page 5

... R 2. 1.2V R 1.75 V 1.50 R 1.25 -40 -25 - Junction Temperature (°C) FIGURE 2-3: Quiescent Current vs. Junction Temperature. © 2007 Microchip Technology Inc. = 1.8V µF Ceramic (X7R), C OUT 1.206 1.204 1.202 1.200 40°C J 1.198 1.196 1.194 1.192 1.190 5.0 5.5 6.0 2 FIGURE 2-4: ...

Page 6

... Load Current (mA) Output Voltage vs. Load = 2.8V +25° 40° 5. +125° 100 150 200 250 Load Current (mA) Output Voltage vs. Load = 5.0V +125° +25° 40° 100 125 150 175 200 225 250 Load Current (mA) Dropout Voltage vs. Load = 2.8V). © 2007 Microchip Technology Inc. ...

Page 7

... Load Current (mA) FIGURE 2-13: Dropout Voltage vs. Load Current (V = 5.0V). R FIGURE 2-14: Power Supply Ripple Rejection vs. Frequency (V = 1.2V). R FIGURE 2-15: Power Supply Ripple Rejection vs. Frequency (V = 2.8V). R © 2007 Microchip Technology Inc. = 1.8V µF Ceramic (X7R), C OUT OUT 0.1 0.01 0.01 200 225 ...

Page 8

... R FIGURE 2-21: Dynamic Load Step . (V = 2.8V) R DS21826B-page 8 = 1.8V µF Ceramic (X7R), C OUT FIGURE 2-22 5.0V) R FIGURE 2-23 2.8V) R FIGURE 2-24 1.2V µF Ceramic (X7R 100 µ Dynamic Load Step . Dynamic Line Step . Startup From V IN © 2007 Microchip Technology Inc. ...

Page 9

... IN 0 -0.1 -0 2.2V IN -0.3 -0.4 -40 -25 - Junction Temperature (°C) FIGURE 2-27: Load Regulation vs. Junction Temperature (V = 1.8V). R © 2007 Microchip Technology Inc. = 1.8V µF Ceramic (X7R), C OUT 0 -0.1 -0.2 -0.3 -0.4 V -0.5 -0.6 -0.7 -40 -25 FIGURE 2-28: IN Junction Temperature (V 0.1 0. -0.05 V -0.1 -0 ...

Page 10

... OUT load currents below 100 mA, the input capacitance requirement can be lowered. The type of capacitor used can be electrolytic. The low ESR characteristics of the ceramic will yield better noise and PSRR performance at high frequency. Function ceramic, tantalum or aluminum © 2007 Microchip Technology Inc. ...

Page 11

... V IN Overcurrent Overtemperature FIGURE 4-1: Block Diagram. © 2007 Microchip Technology Inc. 4.3 Overtemperature The internal power dissipation within the LDO is a function of input-to-output voltage differential and load current. If the power dissipation within the LDO is excessive, the internal junction temperature will rise above the typical shutdown threshold of 140° ...

Page 12

... Output Rise time When powering up the internal reference output, the typical output rise time of 500 µs is controlled to prevent overshoot of the output voltage. ≥ 2.5V). For applications R © 2007 Microchip Technology Inc. ...

Page 13

... MCP1700, the total internal power dissipation is multiplied by the thermal resistance from junction to ambient (Rθ ). The thermal resistance from junction to JA ambient for the SOT-23 pin package is estimated at 230 C/W. ° © 2007 Microchip Technology Inc. EQUATION 6- MAX T = Maximum continuous junction J(MAX) temperature. ...

Page 14

... As long as the average current does not exceed 250 mA, pulsed higher load currents can be applied to the MCP1700 MCP1700 is 550 JRISE A(MAX Ratio Metric Reference ® PIC Microcontroller V OUT REF C OUT 1 µF ADO AD1 Using the MCP1700 The typical current limit for the +25°C). A © 2007 Microchip Technology Inc. ...

Page 15

... Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2007 Microchip Technology Inc. MCP1700 Standard Extended Temp Symbol ...

Page 16

... E 2.10 E1 1.16 D 2.67 L 0.13 φ 0° c 0.08 b 0.30 φ L NOM MAX 3 – 1.12 0.95 1.02 – 0.10 – 2.64 1.30 1.40 2.90 3.05 0.50 0.60 – 10° – 0.20 – 0.54 Microchip Technology Drawing C04-104B © 2007 Microchip Technology Inc. ...

Page 17

... Leads 1 & 3 Width Notes: 1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2007 Microchip Technology Inc ...

Page 18

... BSC: Basic Dimension. Theoretically exact value shown without tolerances. DS21826B-page Units INCHES Dimension Limits MIN .050 BSC D .125 E .175 A .170 R .080 L .500 c .014 b .014 Microchip Technology Drawing C04-101B D MAX .165 .205 .210 .105 – .021 .022 © 2007 Microchip Technology Inc. ...

Page 19

... Updated Packaging Information. • Corrected Section “Product Identification System”. • Changed X5R to X7R in Notes to “DC Characteristics”, “Temperature Specifications”, and “Typical Performance Curves” . Revision A (November 2005) • Original Release of this Document. © 2007 Microchip Technology Inc. MCP1700 DS21826B-page 19 ...

Page 20

... MCP1700 NOTES: DS21826B-page 20 © 2007 Microchip Technology Inc. ...

Page 21

... TO = Plastic Small Outline Transistor (TO-92), 3-lead TT = Plastic Small Outline Transistor SOT-23), 3-lead © 2007 Microchip Technology Inc. X /XX Examples: SOT-89 Package: Temp. Package Range a) MCP1700T-1202E/MB: 1. MCP1700T-1802E/MB: 1. MCP1700T-2502E/MB: 2. MCP1700T-3002E/MB: 3. MCP1700T-3302E/MB: 3. MCP1700T-5002E/MB: 5.0V V TO-92 Package: g) MCP1700-1202E/TO: h) MCP1700-1802E/TO: i) MCP1700-2502E/TO: j) MCP1700-3002E/TO: k) MCP1700-3302E/TO: l) MCP1700-5002E/TO: SOT-23 Package: a) MCP1700T-1202E/TT: b) ...

Page 22

... MCP1700 NOTES: DS21826B-page 22 © 2007 Microchip Technology Inc. ...

Page 23

... Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...

Page 24

... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2007 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...

Related keywords