MCP2200T-I/MQ Microchip Technology, MCP2200T-I/MQ Datasheet
MCP2200T-I/MQ
Specifications of MCP2200T-I/MQ
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MCP2200T-I/MQ Summary of contents
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... Automatic thermal shutdown • Low-power mode: - Receiver monitoring bus and transmitter off, µA) 2010 Microchip Technology Inc. MCP2003/4 Description This device provides a bidirectional, half-duplex communication physical interface to automotive and industrial LIN systems to meet the LIN bus specification Revision 2.1 and SAE J2602. The device is short circuit and overtemperature protected by internal circuitry ...
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... MCP2004 Block Diagram V REN FAULT/TXE DS22230C-page 2 Ratiometric Reference Wake-Up Logic and Power Control OC Thermal Short Circuit Protection Protection Ratiometric Reference Wake-Up Logic and Power Control OC Thermal Short Circuit Protection Protection 2010 Microchip Technology Inc ~30 k L BUS ~30 k L BUS V SS ...
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... The LIN Bus specification states that the LIN pin must transition to the recessive state when ground is disconnected. Therefore, a loss of ground effectively forces the LIN line to a high-impedance level. 2010 Microchip Technology Inc. 1.2.3 THERMAL PROTECTION The thermal protection circuit monitors the die temperature and is able to shut down the LIN transmitter ...
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... FAULT/TXE pin on the MCP2004 is high. Ready Mode VREN OFF and TXD TOFF Mode VREN OFF (Thermal or Timer Power-Down Mode VREN OFF RX OFF TX OFF and TXD = CS = and TXD = Operation and No Fault Mode VREN ON Fault 2010 Microchip Technology Inc. ...
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... OVERVIEW OF OPERATIONAL MODES State Transmitter Receiver POR OFF OFF Ready OFF ON Operation ON ON Power Down OFF Activity Detect Transmitter Off OFF ON 2010 Microchip Technology Inc. Ready Mode VREN OFF CS = TXD = CS = and (TXE = or TXD = ) TXE = CS = and TXE = TOFF and TXD = Mode No Fault VREN ON ...
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... XD CS WAKE Wake- pin. REN +12 +12 50 43V REN V R OLTAGE FAULT/TXE V SS 100 nF Master Node Only 1.0 F µ +12 1 K LIN Bus BUS 27V Master Node Only F 1.0 µ +12 1 K LIN Bus BUS 27V 2010 Microchip Technology Inc. ...
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... EXAMPLE 1-3: TYPICAL LIN NETWORK CONFIGURATION 1 k LIN bus MCP200X Master µC 2010 Microchip Technology Inc. 40m + Return LIN bus LIN bus MCP200X MCP200X Slave 1 Slave 2 µC µC MCP2003/4 LIN bus LIN bus MCP200X Slave n <23 µC DS22230C-page 7 ...
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... Fault Detect Output (OD) Transmitter Enable (TTL) Transmit Data Input (TTL) Ground LIN bus (bidirectional) Battery positive Exposed Thermal Pad. Do not electrically connect or connect to Vss . A BB Table 1-2. The transmitter is disabled pin is also disconnected to reduce BUS output driver. BUS 2010 Microchip Technology Inc. ...
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... The internal LIN receiver observes the activities on the LIN bus, and matches the output signal R the state of the L pin. BUS 2010 Microchip Technology Inc. FAULT/TXE External Driven Input Output H ...
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... MCP2003/4 NOTES: DS22230C-page 10 2010 Microchip Technology Inc. ...
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... Some terms and names used in this data sheet deviate from those referred to in the LIN specifications. Equivalant values are shown below. LIN 2.1 Name V BAT V SUP I _ BUS LIM V BUSREC V BUSDOM 2010 Microchip Technology Inc. .......................................................................................................-0.3 to +30V Term used in the following tables not used BUS V (L ...
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... Transmitter off, bus recessive (Note 1) Transmitter off, bus recessive (Note 12V, GND 0-27V LIN Input voltage = 4.0V Input voltage = 0.5V Output voltage = 0.5V Through a current limiting resistor Input voltage = 4.0V Input voltage = 0. 5.5V LIN BB RXD , REG LBUS BB 2010 Microchip Technology Inc. ...
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... Capacitance of Slave Node C SLAVE Note 1: Internal current limited. 2.0 ms maximum recovery time (R 2: Node has to sustain the current that can flow under this condition; bus must be operational under this condition. 2010 Microchip Technology Inc. Min. Typ. Max. ) 0.6 V — — ...
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... tbus_rec(max)/2 x tbit µs Bus debounce time, 10 µs typical 35 150 µs After Bus debounce time, 52 µs typical 150 µs Vren floating — 150 µs — 80 µs Vren floating Test Conditions <= 18V RXD 2010 Microchip Technology Inc. ...
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... Thermal Resistance, 8L-SOIC Note 1: The maximum power dissipation is a function of T allowable power dissipation at an ambient temperature is P exceeded, the die temperature will rise above 150C and the MCP2003/4 will go into thermal shutdown. 2010 Microchip Technology Inc. Symbol Typ Max Units ...
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... V (V) BB DS22230C-page 16 = 6.0V to 18.0V -40°C to +125°C. A FIGURE 2-3: 0.12 0.1 0.08 -40C 25C 0.06 85C 125C 0.04 0. -40C 25C 85C 125C 18 TYPICAL IBBTO -40C 25C 85C 125C 7.3V 12V 14.4V 18V V (V) BB 2010 Microchip Technology Inc. ...
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... Match Match FAULT Sampling Hold Stable Value FAULT/TXE Output FIGURE 2- TIMING DIAGRAM REN CS V REN FIGURE 2-6: BUS TO V REN L BUS REN 2010 Microchip Technology Inc. 50% T TRANSPDF T RECPDF 50% Match Match T FAULT Stable Value T CSOR T CSPD WAKE TIMING DIAGRAM . BDB ...
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... MCP2003/4 NOTES: DS22230C-page 18 2010 Microchip Technology Inc. ...
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... Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2010 Microchip Technology Inc. MCP2003/4 : Example 2004 ...
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... MCP2003/4 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22230C-page 20 Microchip Technology Drawing C04-131E Sheet 2010 Microchip Technology Inc. ...
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... Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2010 Microchip Technology Inc. MCP2003/4 Microchip Technology Drawing C04-131E Sheet DS22230C-page 21 ...
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... MCP2003/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22230C-page 22 2010 Microchip Technology Inc. ...
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... N NOTE 1RWHV 2010 Microchip Technology Inc. PLO %RG\ >3', MCP2003/4 c DS22230C-page 23 ...
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... MCP2003/4 Note: DS22230C-page 24 2010 Microchip Technology Inc. ...
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... Note: 2010 Microchip Technology Inc. MCP2003/4 DS22230C-page 25 ...
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... MCP2003/4 /HDG 3ODVWLF 6PDOO 2XWOLQH 61 ± 1DUURZ 1RWH DS22230C-page 26 PP %RG\ >62,&@ 2010 Microchip Technology Inc. ...
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... Slave Node” parameter to Table 2.3. Revision C (August 2010) • Updated all references of Sleep mode to Power- Down mode, and updated the Max. parameter for Duty Cycle 2 in Section 2.4 “AC Specifica- tions”. 2010 Microchip Technology Inc. MCP2003/4 DS22230C-page 27 ...
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... MCP2003/4 NOTES: DS22230C-page 28 2010 Microchip Technology Inc. ...
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... Reel) (DFN and SOIC) Temperature Range -40°C to +125°C Package Plastic Micro Small Outline (4x4), 8-lead P = Plastic DIP (300 mil Body), 8-lead, 14-lead SN = Plastic SOIC, (150 mil Body), 8-lead 2010 Microchip Technology Inc. MCP2003/4 . Examples: a) MCP2004-E/MD: Extended Temperature, 8L-DFN pkg. ...
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... MCP2003/4 NOTES: DS22230C-page 30 2010 Microchip Technology Inc. ...
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... PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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