PIC24FJ64GB002-I/SS Microchip Technology, PIC24FJ64GB002-I/SS Datasheet - Page 307

• Manufacturer Part Number: PIC24FJ64GB002-I/SS
• Description: 16-bit, 16 MIPS, 64KB Flash, 8KB RAM, Nanowatt XLP, USB OTG 28 SSOP .209in TUBE
• Manufacturer: Microchip Technology

Specifications of PIC24FJ64GB002-I/SS

• Processor Series: PIC24
• Core: PIC24F
• Data Bus Width: 16 bit
• Program Memory Type: Flash
• Program Memory Size: 64 KB
• Data Ram Size: 8192 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 5
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: SSOP-28
• Development Tools By Supplier: MPLAB Integrated Development Environment
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Supply Current (max): 300 mA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TABLE 29-1:
TABLE 29-2:
 2010 Microchip Technology Inc.
PIC24FJ64GB004 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 300 mil SOIC
Package Thermal Resistance, 6x6x0.9 mm QFN
Package Thermal Resistance, 8x8x1 mm QFN
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
P
P
INT
I
/
O
Junction to ambient thermal resistance; Theta-
=  ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
x (I
DD
DD
– V
Characteristic
OH
–  I
} x I
Rating
OH
OH
)
) +  (V
OL
x I
OL
PIC24FJ64GB004 FAMILY
)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX




P
T
T
JA
JA
JA
JA
A
D
J
33.7
39.3
Min
Typ
-40
-40
49
28
(T
P
J
INT
– T
Max
Typ
—
—
—
—
—
—
+ P
A
)/
I
/
O
JA
DS39940D-page 307
+140
+125
°C/W
°C/W
°C/W
°C/W
Max
Unit
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W