PIC24HJ256GP610A-E/PF Microchip Technology, PIC24HJ256GP610A-E/PF Datasheet - Page 60

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PIC24HJ256GP610A-E/PF

Manufacturer Part Number
PIC24HJ256GP610A-E/PF
Description
16 Bit MCU 40MIPS 256KB FLASH 100 TQFP 14x14x1mm TRAY
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ256GP610A-E/PF

Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (85.5K x 24)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-TQFP
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Number Of Timers
9
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (12 bit, 32 Channel)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24HJ256GP610A-E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
TABLE 8-1:
DS70152H-page 60
Standard Operating Conditions
Operating Temperature: –40ºC-85ºC. Programming at 25ºC is recommended.
Param
P9b
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
No.
Note 1: V
T
T
T
T
T
T
T
T
T
T
T
T
T
Symbol
2: Time depends on the FRC accuracy and the value of the FRC Oscillator tuning register. Refer to
DLY
DLY
DLY
DLY
DLY
R
VALID
DLY
HLD
KEY
KEY
DLY
MCLRH
±0.3V of V
“Electrical Characteristics” section in the specific device data sheet.
5
6
7
8
9
10 Delay between Last PGCx ↓ and MCLR ↓
3
1
2
11 Maximum Wait Time for Configuration
DD
must also be supplied to the AV
Delay between PGDx ↓ by Programming
Executive to PGDx Released by
Programming Executive
PGCx Low Time After Programming
Bulk Erase Time
Page Erase Time
Row Programming Time
MCLR Rise Time to Enter ICSP mode
Data Out Valid from PGCx ↑
MCLR ↓ to V
Delay from First MCLR ↓ to First PGCx ↑
for Key Sequence on PGDx
Delay from Last PGCx ↓ for Key Sequence
on PGDx to Second MCLR ↑
Register Programming
MCLR High Time
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS (CONTINUED)
DD
and V
DD
Characteristic
SS
, respectively.
DD
pins during programming. AV
19.5
1.28
Min
400
330
15
10
25
0
1
Max
100
500
1.0
23
25
DD
Units
and AV
ms
ms
ms
ms
μs
ns
μs
ns
ns
μs
ns
μs
s
© 2010 Microchip Technology Inc.
SS
should always be within
Conditions
See Note 2
See Note 2
See Note 2

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