SSM2211CPZ-R2 Analog Devices Inc, SSM2211CPZ-R2 Datasheet - Page 5

• Manufacturer Part Number: SSM2211CPZ-R2
• Description: IC,Audio Amplifier,SINGLE,CMOS,LLCC,8PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Type: Class ABr

Specifications of SSM2211CPZ-R2

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 1.5W x 1 @ 4 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Differential Inputs, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 8-LFCSP
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.2%%
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Supply Current (max): 20@5V@-40C TO 85CmA
• Power Supply Requirement: Single
• Unity Gain Bandwidth Product (typ): 4MHz
• Rail/rail I/o Type: Rail to Rail Input
• Power Supply Rejection Ratio: 66dB
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: LFCSP EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at T
otherwise noted.
Table 4.
Parameter
Supply Voltage
Input Voltage
Common-Mode Input Voltage
ESD Susceptibility
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature, Soldering (60 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
A
= 25°C, unless
Rating
6 V
V
V
2000 V
−65°C to +150°C
−40°C to +85°C
−65°C to +165°C
300°C
DD
DD
Rev. E | Page 5 of 24
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
8-Lead LFCSP_VD (CP-Suffix)
8-Lead SOIC_N (S-Suffix)
1
2
ESD CAUTION
For the LFCSP_VD, θ
For the SOIC_N, θ
JA
is specified for the worst-case conditions, that is, a device
JA
JA
is measured with the device soldered to a four-layer PCB.
is measured with exposed lead frame soldered to the PCB.
2
1
θ
50
121
JA
SSM2211
Unit
°C/W
°C/W