SSM2211CPZ-REEL Analog Devices Inc, SSM2211CPZ-REEL Datasheet - Page 5

IC,Audio Amplifier,SINGLE,CMOS,LLCC,8PIN,PLASTIC

SSM2211CPZ-REEL

Manufacturer Part Number
SSM2211CPZ-REEL
Description
IC,Audio Amplifier,SINGLE,CMOS,LLCC,8PIN,PLASTIC
Manufacturer
Analog Devices Inc
Type
Class ABr
Datasheet

Specifications of SSM2211CPZ-REEL

Output Type
1-Channel (Mono)
Max Output Power X Channels @ Load
1.5W x 1 @ 4 Ohm
Voltage - Supply
2.7 V ~ 5.5 V
Features
Differential Inputs, Shutdown
Mounting Type
Surface Mount
Package / Case
8-LFCSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at T
otherwise noted.
Table 4.
Parameter
Supply Voltage
Input Voltage
Common-Mode Input Voltage
ESD Susceptibility
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature, Soldering (60 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
A
= 25°C, unless
Rating
6 V
V
V
2000 V
−65°C to +150°C
−40°C to +85°C
−65°C to +165°C
300°C
DD
DD
Rev. E | Page 5 of 24
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
8-Lead LFCSP_VD (CP-Suffix)
8-Lead SOIC_N (S-Suffix)
1
2
ESD CAUTION
For the LFCSP_VD, θ
For the SOIC_N, θ
JA
is specified for the worst-case conditions, that is, a device
JA
JA
is measured with the device soldered to a four-layer PCB.
is measured with exposed lead frame soldered to the PCB.
2
1
θ
50
121
JA
SSM2211
Unit
°C/W
°C/W

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