ISP1105W,115 STEricsson, ISP1105W,115 Datasheet

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ISP1105W,115

Manufacturer Part Number
ISP1105W,115
Description
Manufacturer
STEricsson
Datasheet

Specifications of ISP1105W,115

Number Of Transceivers
1
Esd Protection
YeskV
Power Supply Requirement
Triple
Operating Supply Voltage (typ)
Not RequiredV
Operating Temperature Classification
Industrial
Operating Supply Voltage (max)
Not RequiredV
Operating Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
1.8/2.5/3.3/5V
Dual Supply Voltage (max)
3.6/5.5V
Dual Supply Voltage (min)
1.65/3/4V
Pin Count
16
Mounting
Surface Mount
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Lead Free Status / RoHS Status
Supplier Unconfirmed
 
 
Dear customer, 
As from February 2nd 2009, ST and Ericsson have merged Ericsson Mobile 
Platforms and ST‐NXP Wireless into a 50/50 joint venture "ST‐Ericsson". 
As a result, the following changes are applicable to the attached 
www.stericsson.com 
● Contact information ‐ the list of sales offices previously obtained at  
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under Contacts  
 
If you have any questions related to the document, please contact our 
nearest sales office or wired.support@stericsson.com. 
Thank you for your cooperation and understanding. 
 
 
document. 
 
● Company name ‐ ST‐NXP Wireless is replaced with ST‐Ericsson. 
● Copyright ‐ the copyright notice at the bottom of each page “© ST‐NXP 
Wireless 200x ‐ All rights reserved”, shall now read: “© ST‐Ericsson, 2009 ‐ 
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IMPORTANT NOTICE 

Related parts for ISP1105W,115

ISP1105W,115 Summary of contents

Page 1

... If you have any questions related to the document, please contact our  nearest sales office or wired.support@stericsson.com.  Thank you for your cooperation and understanding.      ...

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ISP1105/1106 Advanced USB transceivers Rev. 09 — 19 January 2009 1. General description The ISP1105/1106 range of Universal Serial Bus (USB) transceivers are compliant with the Universal Serial Bus Specification Rev. 2.0. They can transmit and receive serial data at ...

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Applications Portable electronic devices, such as: Mobile phone Digital still camera Personal Digital Assistant (PDA) Information Appliance (IA). 4. Ordering information Table 1. Ordering information Type number Package Name Description ISP1105BS HVQFN16 plastic thermal enhanced very thin quad flat ...

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Block diagram VMO/FSE0 (1) Connect to D− for low-speed operation. (2) Pin function depends on device type. (3) Only for ISP1105. Fig 1. Block diagram (combined ISP1105 and ISP1106). ISP1105_1106_9 Product data sheet 3.3 V VOLTAGE V CC(I/O) REGULATOR ...

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Pinning information 6.1 Pinning ISP1105BS RCV 2 GND (exposed diepad Bottom view Fig 2. Pin configuration ISP1105BS (HVQFN). V pu(3.3) 1 SOFTCON ...

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Pin description Table 3. Pin description [1] Symbol Pin ISP1105 ISP1106 RCV SUSPND ...

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Table 3. Pin description …continued [1] Symbol Pin ISP1105 ISP1106 VPO/ VPO - - VMO/FSE0 VMO - - 14 12 FSE0 - - - ...

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Functional description 7.1 Function selection Table 4. SUSPND [1] Signal levels on (D+, D−) are determined by other USB devices and external pull-up/down resistors. [2] In ‘suspend’ mode (SUSPND = HIGH) the differential receiver is ...

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Power supply configurations The ISP1105/1106 can be used with different power supply configurations, which can be changed dynamically. An overview is given in Normal mode — Both operation, V regulator then produces 3.3 V for the ...

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Power supply input options The ISP1105/1106 range has two power supply input options. Internal regulator — V used to supply the internal circuitry with 3.3 V (nominal). The V output reference. Regulator bypass — V regulator is bypassed and ...

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Electrostatic discharge (ESD) 8.1 ESD protection The pins that are connected to the USB connector (D+, D−, V minimum of ±12 kV ESD protection. The ±12 kV measurement is limited by the test equipment. Capacitors of 4.7 μF connected ...

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Limiting values Table 11. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC(5.0) V I/O supply voltage CC(I/O) V regulated supply voltage reg(3. input voltage I I latch-up ...

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Static characteristics Table 13. Static characteristics: supply pins reg(3.3) − ° combinations +85 amb Symbol Parameter V ...

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Table 14. Static characteristics: digital pins CC(I/O) GND Symbol Parameter V = 1.65 to 3.6 V CC(I/O) Input levels V LOW-level input voltage IL V HIGH-level input voltage ...

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Table 15. Static characteristics: analog I/O pins (D+, D− reg(3.3) Symbol Parameter Input levels Differential receiver V differential input sensitivity DI V differential ...

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Dynamic characteristics Table 16. Dynamic characteristics: analog I/O pins (D+, D− reg(3.3) − ° combinations +85 amb ...

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Table 16. Dynamic characteristics: analog I/O pins (D+, D− reg(3.3) − ° combinations +85 amb Symbol Parameter Receiver ...

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Test information for Fig 11. Load for enable and disable times. Fig 12. Load for VM, VP and RCV. Load capacitance: (1) C (2) C (1) Full-speed mode: connected to D+; ...

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Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the original dimensions) ...

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HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original ...

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TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 ...

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Packing information The ISP1105/1106W (HBCC16 package) is delivered on a type A carrier tape, see Figure 17. The tape dimensions are given in The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not ...

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Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 16.1 Introduction to soldering Soldering ...

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Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, ...

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MSL: Moisture Sensitivity Level Fig 18. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. ISP1105_1106_9 Product data sheet maximum peak temperature = MSL limit, ...

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Additional soldering information 17.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The layer (0.1 μm min.) ensures solderability, the ...

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Revision history Table 20. Revision history Document ID Release date Data sheet status ISP1105_1106_9 20090119 • Modifications: Globally changed Philips Semiconductors and Philips to ST-NXP Wireless. Also updated the legal text. • Section 8.1 “ESD ISP1105_1106-08 20040219 (9397 750 ...

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Tables Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2 Table 2. Selection guide . . . . . . . . . ...

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Figures Fig 1. Block diagram (combined ISP1105 and ISP1106). 3 Fig 2. Pin configuration ISP1105BS (HVQFN Fig 3. Pin configuration ISP1105W (HBCC16 Fig ...

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Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . ...

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Information in this document is provided solely in connection with ST-NXP products. ST-NXP Wireless NV and its subsidiaries (“ST-NXP”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at ...

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