K4T1G164QE-HCE6000 Samsung Semiconductor, K4T1G164QE-HCE6000 Datasheet - Page 19

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K4T1G164QE-HCE6000

Manufacturer Part Number
K4T1G164QE-HCE6000
Description
Manufacturer
Samsung Semiconductor
Type
DDR2 SDRAMr
Datasheet

Specifications of K4T1G164QE-HCE6000

Organization
64Mx16
Density
1Gb
Address Bus
16b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
115mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
K4T1G084QE
K4T1G164QE
12.0 Input/Output capacitance
13.0 Electrical Characteristics & AC Timing for DDR2-800/667
13.1 Refresh Parameters by Device Density
13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
K4T1G044QE
Input capacitance, CK and CK
Input capacitance delta, CK and CK
Input capacitance, all other input-only pins
Input capacitance delta, all other input-only pins
Input/output capacitance, DQ, DM, DQS, DQS
Input/output capacitance delta, DQ, DM, DQS, DQS
Refresh to active/Refresh command time
Average periodic refresh interval
Bin (CL - tRCD - tRP)
(0 °C < T
Parameter
tCK, CL=3
tCK, CL=4
tCK, CL=5
tCK, CL=6
Speed
tRCD
tRAS
tRP
tRC
OPER
Parameter
< 95 °C; V
Parameter
DDQ
3.75
12.5
12.5
57.5
min
2.5
45
5
-
= 1.8V + 0.1V; V
DDR2-800(E7)
5-5-5
tRFC
tREFI
70000
max
8
8
8
-
-
-
-
DD
0 °C ≤ T
85 °C < T
= 1.8V + 0.1V)
Symbol
CASE
19 of 45
CASE
3.75
min
2.5
15
15
60
45
≤ 85°C
3
-
≤ 95°C
DDR2-800(F7)
Symbol
CDCK
CDIO
CCK
CDI
CIO
6-6-6
CI
70000
max
256Mb
8
8
8
-
-
-
-
7.8
3.9
75
Min
1.0
1.0
2.5
x
x
x
DDR2-667
512Mb
105
7.8
3.9
3.75
min
15
15
60
45
Max
0.25
0.25
2.0
2.0
3.5
0.5
5
3
-
DDR2-667(E6)
127.5
1Gb
5 - 5 - 5
7.8
3.9
Rev. 1.1 December 2008
Min
1.0
1.0
2.5
x
x
x
70000
DDR2-800
DDR2 SDRAM
max
2Gb
195
7.8
3.9
8
8
8
-
-
-
-
Max
0.25
1.75
0.25
2.0
3.5
0.5
327.5
4Gb
7.8
3.9
Units
ns
ns
ns
ns
ns
ns
ns
ns
Units
Units
pF
pF
pF
pF
pF
pF
µs
µs
ns

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