EMIF03-SIM01F2 STMicroelectronics, EMIF03-SIM01F2 Datasheet

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EMIF03-SIM01F2

Manufacturer Part Number
EMIF03-SIM01F2
Description
IC FILTER EMI 3 LINE FLIPCHIP
Manufacturer
STMicroelectronics
Series
IPAD™r
Datasheet

Specifications of EMIF03-SIM01F2

Filter Type
Signal Line
Voltage - Rated
3V
Mounting Type
Surface Mount
Termination Style
Surface Mount (SMD,SMT)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Inductance
-
Other names
497-3401-2

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
EMIF03-SIM01F2AU
Manufacturer:
ST
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Part Number:
EMIF03-SIM01F2_
Manufacturer:
ST
0
Features
Complies with the following standards
Applications
EMI filtering and ESD protection for:
Description
The EMIF03-SIM01F2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF03 Flip Chip packaging
means the package size is equal to the die size.
This filter includes ESD protection circuitry which
prevents damage to the application when
subjected to ESD surges up 15 kV.
April 2008
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Lead-free package
Very low PCB space occupation:
1.42 mm x 1.42 mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
High reliability offered by monolithic integration
High reduction of parasitic elements through
integration and wafer level packaging
IEC 61000-4-2 level 4 on input pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL SRD 883E - Method 3015-6 Class 3
SIM interface (subscriber identity module)
UIM interface (universal identity module)
3-line IPAD™, EMI filter including ESD protection
Rev 3
Figure 1.
Figure 2.
TM: IPAD is a trademark of STMicroelectronics.
Data in
CLK in
RST in
V
CC
Pin layout (bump side)
Configuration
EMIF03-SIM01F2
Data
RST
CLT
3
in
in
in
(8 bumps)
Flip Chip
RST
Gnd
V
out
2
CC
100 Ω
100 Ω
47 Ω
GND
R2
R3
R1
Data
CLT
out
out
1
A
B
C
Cline = 35pF max.
www.st.com
RST out
CLK out
Data out
1/7
7

Related parts for EMIF03-SIM01F2

EMIF03-SIM01F2 Summary of contents

Page 1

... SIM interface (subscriber identity module) ■ UIM interface (universal identity module) Description The EMIF03-SIM01F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 Flip Chip packaging means the package size is equal to the die size. ...

Page 2

... Series resistance between input and R I/O output C Input capacitance per line line Symbol line 2/7 Parameter = 25 °C) amb Parameters RM Test conditions = 3 V per line EMIF03-SIM01F2 Value 125 -40 to +85 -55 to 150 Min Typ Max 6 1 1.5 95 100 105 44.65 47 49.35 95 100 105 ...

Page 3

... EMIF03-SIM01F2 Figure 3. S21 (dB) attenuation measurement Figure 4. Aplac 7.60 User: STMicroelectronics Feb 22 2001 0.00 dB -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 -35.00 -40.00 -45.00 -50.00 100.0k 1.0M 10.0M f/Hz B3_B1(CLK) A3_A2(RST) Figure 5. Digital crosstalk measurement Figure 7. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input ...

Page 4

... Package F = Flip Chip Lead-free, pitch = 500 µm, bump = 315 µm 4/7 Rseries MODEL = demif03 sub MODEL = demif03_Vcc Rseries = 47R (CLK line) = 100R (RST & Data lines) EMIF03-SIM01F2 Port2 50 DEMIF03 diodes Model - RS = 1.2 - CJO = 17p - M = 0.3333 - VJ = 0.6 - ISR = 100p - BV = 6.8 - IBV = 100n ...

Page 5

... EMIF03-SIM01F2 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...

Page 6

... Marking Package FC Flip Chip Revision 1 Initial release. 2 Table 3. on page 6: Flip Chip weight corrected from 3 2.9 mg. Updated ECOPACK statement. Updated 3 Figure 14. Reformatted to current standards. EMIF03-SIM01F2 Weight Base qty Delivery mode 2.9 mg 5000 Tape and reel 7” Changes Figure 10, Figure 11 and ...

Page 7

... EMIF03-SIM01F2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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