MT41J256M8HX-15E:D Micron Technology Inc, MT41J256M8HX-15E:D Datasheet - Page 42

• Manufacturer Part Number: MT41J256M8HX-15E:D
• Description: MICMT41J256M8HX-15E:D 2GB:X4,X8,X16 DDR3
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr
• Series: -r

Specifications of MT41J256M8HX-15E:D

• Organization: 256Mx8
• Address Bus: 18b
• Maximum Clock Rate: 1.333GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Supply Current: 165mA
• Pin Count: 78
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Format - Memory: RAM
• Memory Type: DDR3 SDRAM
• Memory Size: 2G (256M x 8)
• Speed: 667MHz
• Interface: Parallel
• Voltage - Supply: 1.425 V ~ 1.575 V
• Operating Temperature: 0°C ~ 95°C
• Package / Case: 78-TFBGA
• Lead Free Status / RoHS Status: Compliant

Electrical Specifications – DC and AC
DC Operating Conditions
Table 23:
Input Operating Conditions
Table 24:
PDF: 09005aef826aaadc/Source: 09005aef82a357c3
DDR3_D3.fm - Rev G 2/09 EN
Parameter/Condition
Parameter/Condition
Supply voltage
I/O supply voltage
Input leakage current
Any input 0V ≤ V
(All other pins not under test = 0V)
V
V
(All other pins not under test = 0V)
V
V
Input reference voltage command/address bus
I/O reference voltage DQ bus
I/O reference voltage DQ bus in SELF REFRESH
Command/address termination voltage
(system level, not direct DRAM input)
REF
REF
IN
IN
low; DC/commands/address busses
high; DC/commands/address busses
DQ = V
supply leakage current
DD
DC Electrical Characteristics and Operating Conditions
All voltages are referenced to V
DC Electrical Characteristics and Input Conditions
All voltages are referenced to V
/2 or V
IN
Notes:
Notes:
≤ V
REF
DD
CA = V
, V
REF
1. V
2. V
3. V
4. The minimum limit requirement is for testing purposes. The leakage current on the V
1. V
2. DC values are determined to be less than 20 MHz in frequency. DRAM must meet specifica-
3. V
4. V
5. V
DD
pin 0V ≤ V
(0Hz to 250 kHz) specifications. V
parameters.
should be minimal.
Externally generated peak noise (noncommon mode) on V
around the V
V
tions if the DRAM induces additional AC noise greater than 20 MHz in frequency.
level. Externally generated peak noise (noncommon mode) on V
× V
±2% of V
within restrictions outlined in the SELF REFRESH section.
tors. MIN and MAX values are system-dependent.
/2
DD
DD
REF
REF
REF
REF
REF
TT
DD
is not applied directly to the device. V
CA(
CA(
DQ(
DQ(
and V
and V
(see Table 24).
around the V
DC
DC
DC
DC
REF
IN
) is expected to be approximately 0.5 × V
).
DD
DD
) is expected to be approximately 0.5 × V
) may transition to V
DQ(
≤ 1.1V
Q must track one another. V
Q may include AC noise of ±50mV (250 kHz to 20 MHz) in addition to the DC
REF
SS
SS
CA(
DC
).
V
V
V
REF
DC
Symbol
REF
REF
REF
) value. Peak-to-peak AC noise on V
DQ(
V
V
V
Symbol
DQ(
CA(
DQ(
IH
TT
IL
V
I
V
VREF
DD
DC
DD
I
DC
DC
SR
I
42
) value. Peak-to-peak AC noise on V
Q
)
)
)
REF
DD
See Table 23
DQ(
0.49 × V
0.49 × V
and V
1.425
1.425
Min
Min
SR
V
V
Micron Technology, Inc., reserves the right to change products or specifications without notice.
–2
–1
–
SS
SS
) and back to V
Electrical Specifications – DC and AC
DD
TT
DD
DD
DD
Q must be less than or equal to V
is a system supply for signal termination resis-
Q must be at same level for valid AC timing
0.5 × V
0.5 × V
0.5 × V
0.5 × V
Nom
2Gb: x4, x8, x16 DDR3 SDRAM
1.5
1.5
DD
Nom
–
–
DD
n/a
n/a
and to track variations in the DC level.
and to track variations in the DC
DD
REF
DD
DD
DD
Q
REF
DQ(
REF
1.575
1.575
Max
CA should not exceed ±2% of
CA may not exceed ±1% × V
See Table 23
DC
0.51 × V
0.51 × V
2
1
REF
©2006 Micron Technology, Inc. All rights reserved.
) when in SELF REFRESH,
REF
Max
V
V
DQ may not exceed ±1%
DD
DD
–
DQ should not exceed
DD
DD
Units
µA
µA
V
V
Units
DD
V
V
V
V
V
V
. V
SS
Notes
1, 2
1, 2
3, 4
Notes
= V
REF
1, 2
2, 3
4
5
SS
pin
DD
Q.