MT29F8G08ABABAWP:B Micron Technology Inc, MT29F8G08ABABAWP:B Datasheet - Page 140

• Manufacturer Part Number: MT29F8G08ABABAWP:B
• Manufacturer: Micron Technology Inc

Specifications of MT29F8G08ABABAWP:B

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Figure 107: 52-Pad ULGA Package
PDF: 09005aef8386131b / Source: 09005aef838cad98
m61a_async_sync_nand.fm - Rev. A 2/09 EN
Pads Ø 0.70
Non solder mask defined.
Pads Ø 1.00
Non solder mask defined.
13.00
NOTE 1: Pads are plated with 5-16 microns of nickel
Seating
12.00
plane
12X Ø1.00 ±0.05
40X Ø0.70 ±0.05
10.00
followed by a minimum of 0.50 microns of
soft wire bondable gold (99.9% pure).
5.00
6.00
0.10 A
PAD A6
Notes:
2.00
TYP
1
1
A
1. All dimensions are in millimeters.
2. Solder pads are nonsolder-mask defined (NSMD).
3. Primary datum A (seating plane) is defined by the bottom terminal surface. Metallized test
6.00 ±0.05
terminal lands or interconnect terminals need not extend below the package bottom sur-
face.
12.00 ±0.10
2.00
10.00
4.00
6.00
C L
Micron Confidential and Proprietary
3.00
2.00
TYP
5.00
8Gb Asychronous/Synchronous NAND Flash Memory
140
Pad A1
C L
7.80
2.00
TYP
Ø0.70 Pad A1 ID
8.50 ±0.05
6.50
Micron Technology, Inc., reserves the right to change products or specifications without notice.
17.00 ±0.10
0.65 MAX
Substrate material: Plastic laminate
Mold compound: Epoxy novolac
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Pad A1 ID
Advance