MT29F8G08ABABAWP:B Micron Technology Inc, MT29F8G08ABABAWP:B Datasheet - Page 141

• Manufacturer Part Number: MT29F8G08ABABAWP:B
• Manufacturer: Micron Technology Inc

Specifications of MT29F8G08ABABAWP:B

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Figure 108: 100-Ball VBGA (Package Code H1), 12×18
PDF: 09005aef8386131b / Source: 09005aef838cad98
m61a_async_sync_nand.fm - Rev. A 2/09 EN
Dimensions
apply to solder
balls post-reflow.
Pre-reflow balls
are Ø0.42 on Ø0.4
SMD ball pads.
100X Ø0.45
Seating
16
plane
0.1 A
8
5
1 TYP
1 TYP
7
1 TYP
A
Notes:
10
9
1. All dimensions in
8
7
12 ±0.1
6
9
5
4
Micron Confidential and Proprietary
4.5
6 ±0.05
3
2
millimeters
8Gb Asychronous/Synchronous NAND Flash Memory
1
A
B
D
E
F
G
H
J
K
L
M
N
P
T
U
Exposed
plated features
in all corners
are floating
nonbiased metal.
141
9 ±0.05
Ball A1 ID
.
0.64 ±0.05
18 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material: SAC305
Substrate material: plastic laminate
Mold compound: epoxy novolac
(96.5% Sn, 3% Ag, 0.5% Cu)
Ball A1 ID
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
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