S25FL016A0LMFI011 Spansion Inc., S25FL016A0LMFI011 Datasheet - Page 24

• Manufacturer Part Number: S25FL016A0LMFI011
• Manufacturer: Spansion Inc.

Specifications of S25FL016A0LMFI011

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 10ns
• Interface Type: Serial (SPI)
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC W
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 2M
• Supply Current: 19mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Compliant

9.12
24
Release from Deep Power Down (RES)
The device requires the Release from Deep Power Down (RES) command to exit the Deep Power Down
mode. When the device is in the Deep Power Down mode, all commands except RES are ignored.
The host system must drive CS# low and write the RES command to SI. CS# must be driven low for the entire
duration of the sequence. The command sequence is shown in
The host system must drive CS# high t
from DP mode to the standby mode after a delay of t
the device can execute any read or write command.
SCK
CS#
SO
SI
Hi-Z
Mode 3
Mode 0
SCK
CS#
SI
SO
Figure 9.12 Release from Deep Power Down (RES) Command Sequence
Mode 3
Mode 0
Hi-Z
Figure 9.11 Deep Power Down (DP) Command Sequence
0
1
0
2
Command
RES(max)
S25FL016A
1
Deep Power-down Mode
3
D a t a
2
4
Command
after the 8-bit RES command byte. The device transitions
3
5
RES
4
Standby Mode
6
S h e e t
(see
5
7
Table 16.1 on page
6
Figure 9.12
7
t DP
S25FL016A_00_C4 February 27, 2009
t
RES
and
Deep Power-down Mode
Table 9.4 on page
Standby Mode
29). In the standby mode,
25.