S25FL016A0LMFI011

Manufacturer Part NumberS25FL016A0LMFI011
ManufacturerSpansion Inc.
S25FL016A0LMFI011 datasheet
 


Specifications of S25FL016A0LMFI011

Cell TypeNORDensity16Mb
Access Time (max)10nsInterface TypeSerial (SPI)
Boot TypeNot RequiredAddress Bus1b
Operating Supply Voltage (typ)3/3.3VOperating Temp Range-40C to 85C
Package TypeSOIC WProgram/erase Volt (typ)2.7 to 3.6V
Sync/asyncSynchronousOperating Temperature ClassificationIndustrial
Operating Supply Voltage (min)2.7VOperating Supply Voltage (max)3.6V
Word Size8bNumber Of Words2M
Supply Current19mAMountingSurface Mount
Pin Count8Lead Free Status / RoHS StatusCompliant
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CS#
Mode 3
SCK
Mode 0
SI
Hi-Z
SO
9.12
Release from Deep Power Down (RES)
The device requires the Release from Deep Power Down (RES) command to exit the Deep Power Down
mode. When the device is in the Deep Power Down mode, all commands except RES are ignored.
The host system must drive CS# low and write the RES command to SI. CS# must be driven low for the entire
duration of the sequence. The command sequence is shown in
The host system must drive CS# high t
from DP mode to the standby mode after a delay of t
the device can execute any read or write command.
Figure 9.12 Release from Deep Power Down (RES) Command Sequence
CS#
Mode 3
SCK
Mode 0
SI
Hi-Z
SO
24
D a t a
S h e e t
Figure 9.11 Deep Power Down (DP) Command Sequence
0
1
2
3
4
5
6
7
Command
Standby Mode
after the 8-bit RES command byte. The device transitions
RES(max)
(see
Table 16.1 on page
RES
0
1
2
3
4
5
6
Command
Deep Power-down Mode
S25FL016A
t DP
Deep Power-down Mode
Figure 9.12
and
Table 9.4 on page
25.
29). In the standby mode,
7
t
RES
Standby Mode
S25FL016A_00_C4 February 27, 2009