MT45W1MW16BDGB-701 IT Micron Technology Inc, MT45W1MW16BDGB-701 IT Datasheet - Page 20

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MT45W1MW16BDGB-701 IT

Manufacturer Part Number
MT45W1MW16BDGB-701 IT
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT45W1MW16BDGB-701 IT

Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Figure 14:
PDF: 09005aef81cb58ed/Source: 09005aef81c7a667
16mb_burst_cr1_0_p23z_2.fm - Rev. H 4/08 EN
DQ[15:0]
LB#/UB#
A[18:0]
ADV#
WAIT
A19
WE#
OE#
CLK
CRE
CE#
2
Configuration Register WRITE in Synchronous Mode Followed by READ ARRAY
Operation
Notes:
High-Z
Latch Control Register Value
t CEW
t CSP
t SP
t SP
t SP
t SP
OPCODE
1. Non-default BCR settings for CR WRITE in synchronous mode followed by READ ARRAY
2. A[19] = LOW to load RCR; A[19] = HIGH to load BCR.
3. CE# must remain LOW to complete a burst-of-one WRITE. WAIT must be monitored—addi-
t HD
t HD
t HD
t HD
operation: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay.
tional WAIT cycles caused by refresh collisions require a corresponding number of addi-
tional CE# LOW cycles.
16Mb: 1 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
Latch Control Register Address
20
t CBPH
Micron Technology, Inc., reserves the right to change products or specifications without notice.
High-Z
3
ADDRESS
ADDRESS
Configuration Registers
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DON’T CARE
VALID
DATA

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