MT36HTF51272PY-667G1 Micron Technology Inc, MT36HTF51272PY-667G1 Datasheet

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MT36HTF51272PY-667G1

Manufacturer Part Number
MT36HTF51272PY-667G1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT36HTF51272PY-667G1

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240RDIMM
Device Core Size
72b
Organization
512Mx72
Total Density
4GByte
Chip Density
1Gb
Access Time (max)
45ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
2.556A
Number Of Elements
36
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / RoHS Status
Compliant
DDR2 SDRAM Registered DIMM (RDIMM)
MT36HTF25672(P) – 2GB
MT36HTF51272(P) – 4GB
For the latest component data sheets, refer to Micron’s Web site:
Features
• 240-pin, registered dual in-line memory module
• Fast data transfer rates: PC2-3200, PC2-4200,
• 2GB (256 Meg x 72), 4GB (512 Meg x 72)
• Supports ECC error detection and correction
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Dual rank
• Multiple internal device banks for concurrent
• Programmable CAS# latency (CL)
• Posted CAS# additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths: 4 or 8
• Adjustable data-output drive strength
• 64ms, 8,192-cycle refresh
• On-die termination (ODT)
• Serial presence-detect (SPD) with EEPROM
• Gold edge contacts
Table 1:
PDF: 09005aef818e3fc8/Source: 09005aef818e3fdb
HTF36C256_512x72.fm - Rev. C 1/07 EN
PC2-5300, or PC2-6400
operation
Speed
Grade
-80E
-800
-667
-53E
-40E
DD
DDSPD
= V
DD
= +1.7V to +3.6V
Q = +1.8V
Key Timing Parameters
Products and specifications discussed herein are subject to change by Micron without notice.
Nomenclature
Industry
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
t
CL = 6
CK
800
2GB, 4GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM
Data Rate (MT/s)
CL = 5
800
667
667
1
CL = 4
533
400
533
533
533
Figure 1:
Notes: 1. Contact Micron for industrial temperature
Height: 30mm (1.18in)
Options
• Parity
• Operating temperature
• Package
• Frequency/CAS latency
• PCB height
www.micron.com
– Commercial (0°C ≤ T
– 240-pin DIMM (Pb-free)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
– 5.0ns @ CL = 3 (DDR2-400)
– 30mm (1.18in)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Contact Micron for product availability.
3. CL = CAS (READ) latency; registered mode
CL = 3
module offerings.
will add one clock cycle to CL.
400
400
400
240-Pin DIMM
(MO-237 R/C L–4GB, R/C J–2GB)
t
(ns)
12.5
RCD
15
15
15
15
C
3
≤ +85°C)
©2005 Micron Technology, Inc. All rights reserved.
2
2
1
(ns)
12.5
t
15
15
15
15
RP
Marking
Features
None
-80E
-53E
-40E
-800
-667
P
Y
(ns)
t
55
55
55
55
55
RC

Related parts for MT36HTF51272PY-667G1

MT36HTF51272PY-667G1 Summary of contents

Page 1

... MT36HTF25672(P) – 2GB MT36HTF51272(P) – 4GB For the latest component data sheets, refer to Micron’s Web site: Features • 240-pin, registered dual in-line memory module • Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300, or PC2-6400 • 2GB (256 Meg x 72), 4GB (512 Meg x 72) • ...

Page 2

... Table 2: Addressing Refresh count Row address Device bank address Device page size per bank Device configuration Column address Module rank address Table 3: Part Numbers and Timing Parameters – 2GB Modules Base device: MT47H128M4 Module 1 Part Number Density MT36HTF25672(P)Y-80E__ MT36HTF25672(P)Y-800__ MT36HTF25672(P)Y-667__ MT36HTF25672(P)Y-53E__ ...

Page 3

Pin Assignments and Descriptions Table 5: Pin Assignments 240-Pin RDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ19 61 REF DQ0 33 DQ24 63 4 DQ1 34 ...

Page 4

... Data input/output: Bidirectional data bus. (SSTL_18) CB0–CB7 I/O Check bits. (SSTL_18) SDA I/O Serial presence-detect data: SDA is a bidirectional pin used to transfer addresses and data into and out of the presence-detect portion of the module Output Parity error found on the address and control bus (open drain) ...

Page 5

Functional Block Diagrams Figure 2: Functional Block Diagram – 2GB V SS RS0# RS1# DQS0 DQS0# DQS1 DQS1# DQS2 DQS2# DQS3 DQS3# DQS8 DQS8# DQS4 DQS4# DQS5 DQS5# DQS6 DQS6# DQS7 DQS7# Rank 0 = U1–U5, U8–U16, U18–U21 Rank 1 ...

Page 6

Figure 3: Functional Block Diagram – 4GB V SS RS0# RS1# Rank 0 = U1–U5, U8–U16, U18–U21 Rank 1 = U22–U25, U27–U40 S0# S1# BA0–BA1 A0–A13 RAS# CAS# WE# CKE0 CKE1 ODT0 ODT1 PAR_IN RESET# PDF: 09005aef818e3fc8/Source: 09005aef818e3fdb HTF36C256_512x72.fm - ...

Page 7

... DDR2 SDRAM modules incorporate serial presence-detect (SPD). The SPD function is implemented using a 2,048-bit EEPROM. This nonvolatile storage device contains 256 bytes. The first 128 bytes can be programmed by Micron to identify the module type and various SDRAM organizations and timing parameters. The remaining 128 bytes of storage are available for use by the customer ...

Page 8

... Simulations are significantly more accurate and realistic than a gross estimation of module capacitance when inductance and delay parameters associated with trace lengths are used in simulations. JEDEC modules are currently designed using simulations to close timing budgets. Component Timing and Operating Conditions Recommended AC operating conditions are given in the DDR2 component data sheets. Component specifications are available on Micron’ ...

Page 9

... DD HIGH HIGH between valid commands; Address bus inputs are stable during DESELECTs; Data bus inputs are switching Notes: 1. Value calculated as one module rank in this operating condition, all other module ranks Value calculated reflects all module ranks in this operating condition. PDF: 09005aef818e3fc8/Source: 09005aef818e3fdb HTF36C256_512x72 ...

Page 10

... DD HIGH HIGH between valid commands; Address bus inputs are stable during DESELECTs; Data bus inputs are switching Notes: 1. Value calculated as one module rank in this operating condition, all other module ranks Value calculated reflects all module ranks in this operating condition. PDF: 09005aef818e3fc8/Source: 09005aef818e3fdb HTF36C256_512x72 ...

Page 11

... Timing and switching specifications for the register listed above are critical for proper oper- ation of the DDR2 SDRAM registered DIMMs. These are meant subset of the param- eters for the specific device used on the module. Detailed information for this register is available in JEDEC Standard JESD82. ...

Page 12

Table 12: PLL Specifications CU877 device or equivalent JESD82-8.01 Parameter Symbol DC high-level input voltage V DC low-level input voltage V Input voltage (limits high-level input voltage V DC low-level input voltage V Input differential-pair cross V voltage ...

Page 13

Serial Presence-Detect Table 14: Serial Presence-Detect EEPROM DC Operating Conditions All voltages referenced to V Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage 3mA OUT Input ...

Page 14

... Number of SPD bytes used by Micron 1 Total number of bytes in SPD device 2 Fundamental memory type 3 Number of row addresses on SDRAM 4 Number of column addresses on SDRAM 5 DIMM height and module ranks 6 Module data width 7 Reserved 8 Module voltage interface levels t 9 SDRAM cycle time, CK (CL = MAX value, see byte 18) ...

Page 15

... SDRAM access from CK, 27 MIN row precharge time, 28 MIN row active-to-row active, 29 MIN RAS#-to-CAS# delay, 30 MIN active-to-precharge time, 31 Module rank density 32 Address and command setup time, 33 Address and command hold time, 34 Data/data mask input setup time, 35 Data/data mask input hold time, t ...

Page 16

... SPD revision 63 Checksum for bytes 0–62 ECC/ECC and Parity 64 Manufacturer’s JEDEC ID code 65–71 Manufacturer’s JEDEC ID code 72 Manufacturing location 73–90 Module part number (ASCII) 91 PCB identification code 92 Identification code (continued) 93 Year of manufacture in BCD 94 Week of manufacture in BCD 95–98 Module serial number 99– ...

Page 17

... U36 U38 U39 U35 U40 U37 5.0 (0.197) TYP 63.0 (2.48) TYP Micron Technology, Inc., reserves the right to change products or specifications without notice. 17 Module Dimensions U10 U11 30.50 (1.20) 29.85 (1.175) U20 U21 17.78 (0.70) TYP 10.0 (0.394) TYP PIN 120 ...

Page 18

... U35 U36 U37 U38 5.0 (0.197) TYP 63.0 (2.48) TYP ® their respective owners. Micron Technology, Inc., reserves the right to change products or specifications without notice. 18 Module Dimensions U10 U11 30.50 (1.20) 29.85 (1.175) U20 U21 17.78 (0.70) TYP 10.0 (0.394) TYP ...

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