MT16JSS51264HY-1G1A1 Micron Technology Inc, MT16JSS51264HY-1G1A1 Datasheet

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MT16JSS51264HY-1G1A1

Manufacturer Part Number
MT16JSS51264HY-1G1A1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT16JSS51264HY-1G1A1

Main Category
DRAM Module
Sub-category
DDR3 SDRAM
Module Type
204SODIMM
Device Core Size
64b
Organization
512Mx64
Total Density
4GByte
Maximum Clock Rate
1.066GHz
Operating Supply Voltage (typ)
1.5V
Operating Current
2.24A
Number Of Elements
16
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
204
Mounting
Socket
Lead Free Status / RoHS Status
Compliant
DDR3 SDRAM SODIMM
MT16JSS51264H – 4GB
For component data sheets, refer to Micron’s Web site:
Features
• DDR3 functionality and operations supported as
• 204-pin, small-outline dual in-line memory module
• Fast data transfer rates: PC3-10600, PC3-8500,
• 4GB (512 Meg x 64)
• Vdd = 1.5V ±0.075V
• Vddspd = +3.0V to +3.6V
• Nominal and dynamic on-die termination (ODT) for
• Dual rank, using 4Gb TwinDie™ DRAM
• On-board I
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Lead-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1:
PDF: 09005aef832ed836/Source: 09005aef832ed8fb
JSS16C512x64H.fm - Rev. B 12/08 EN
Speed
Grade
defined in the component data sheet
(SODIMM)
or PC3-6400
data and strobe mask signals
serial presence-detect (SPD) EEPROM
via the mode register set (MRS)
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Nomenclature
2
PC3-10600
PC3-10600
PC3-10600
Key Timing Parameters
Industry
PC3-8500
PC3-8500
PC3-6400
PC3-6400
C temperature sensor with integrated
Products and specifications discussed herein are subject to change by Micron without notice.
CL = 10
1333
1333
1333
CL = 9
1333
1333
Data Rate (MT/s)
CL = 8
1333
1066
1066
1066
1066
www.micron.com
4GB (x64, DR): 204-Pin DDR3 SDRAM SODIMM
1
CL = 7
1066
1066
1066
Figure 1:
Notes: 1. Contact Micron for industrial temperature
Options
• Operating temperature
• Package
• Frequency/CAS latency
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 204-pin DIMM (lead-free)
– 1.5ns @ CL = 8 (DDR3-1333)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.5ns @ CL = 10 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
– 1.87ns @ CL = 8 (DDR3-1066)
– 2.5ns @ CL = 5 (DDR3-800)
– 2.5ns @ CL = 6 (DDR3-800)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Not recommended for new designs.
CL = 6
800
800
800
800
800
800
800
module offerings.
PCB height: 30.0mm (1.18in)
204-Pin SODIMM (MO-268 R/C D)
CL = 5
800
800
A
A
1
≤ +85°C)
≤ +70°C)
13.125
t
(ns)
13.5
12.5
RCD
©2008 Micron Technology, Inc. All rights reserved.
12
15
15
15
2
2
2
2
2
13.125
(ns)
13.5
12.5
t
12
15
15
15
RP
Marking
Features
None
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Y
I
50.625
(ns)
49.5
52.5
52.5
t
48
51
50
RC

Related parts for MT16JSS51264HY-1G1A1

MT16JSS51264HY-1G1A1 Summary of contents

Page 1

... For component data sheets, refer to Micron’s Web site: Features • DDR3 functionality and operations supported as defined in the component data sheet • 204-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC3-10600, PC3-8500, or PC3-6400 • 4GB (512 Meg x 64) • ...

Page 2

... The data sheet for the base device can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT16JSS51264HY-1G1D1. PDF: 09005aef832ed836/Source: 09005aef832ed8fb JSS16C512x64H.fm - Rev. B 12/08 EN ...

Page 3

Pin Assignments and Descriptions Table 4: Pin Assignments 204-Pin DDR3 SODIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol 1 Vrefdq 53 DQ19 105 3 Vss 55 Vss 107 5 DQ0 57 DQ24 109 7 DQ1 59 DQ25 111 ...

Page 4

... Input with write data. Center-aligned with write data. SDA I/O Serial data: SDA is a bidirectional pin used to transfer addresses and data into and out of the temperature sensor/SPD EEPROM on the module on the I EVENT# Output Temperature event: The EVENT# pin is asserted by the temperature sensor when critical (open drain) temperature thresholds have been exceeded ...

Page 5

Functional Block Diagram Figure 2: Functional Block Diagram S1# S0# DQS0# DQS0 DM0 DM DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ Vss ZQ DQS1# DQS1 DM1 DM DQ8 DQ DQ9 DQ ...

Page 6

... DRAM is connected to a single trace and terminated (rather than a tree structure, where the termination is off the module near the connector). Inherent to fly-by topology, the timing skew between the clock and DQS signals can be easily accounted for by using the write-leveling feature of DDR3 ...

Page 7

... Electrical Specifications Stresses greater than those listed in Table 6 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability ...

Page 8

... Micron encourages designers to simulate the signal characteristics of the system’s memory bus to ensure adequate signal integrity of the entire memory system. Power Operating voltages are specified at the DRAM, not at the edge connector of the module. Designers must account for any system voltage drops at anticipated power levels to ensure the required supply voltage is maintained. ...

Page 9

Idd Specifications Table 9: DDR3 Idd Specifications and Conditions – 4GB Values are for the MT41J512M8THU DDR3 SDRAM only and are computed from values specified in the 4Gb TwinDie (512 Meg x 8) component data sheet Parameter Operating current 0: ...

Page 10

... Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 10: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current: Vdd = 3.3V Input high voltage: Logic 1; SCL, SDA Input low voltage: Logic 0 ...

Page 11

The compare mode is similar to the interrupt mode, except EVENT# cannot be reset by the user and only returns to the logic HIGH state when the temperature falls below the programmed thresholds. Critical temperature mode triggers EVENT# only when ...

Page 12

Table 12: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register Alarm temperature lower boundary register Critical temperature register Temperature register Pointer Register The pointer register selects which of the 16-bit registers is being ...

Page 13

Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. This register is a read-only register. Table 15: Capability Register (Address: 0x00 RFU RFU 7 6 RFU RFU Table 16: Capability Register ...

Page 14

Table 18: Configuration Register Bit Descriptions Bit Description 0 Event mode 0: Comparator mode 1: Interrupt mode 1 EVENT# polarity 0: Active LOW 1: Active HIGH 2 Critical event only 0: EVENT# trips on alarm or critical temperature event 1: ...

Page 15

Figure 4: Hysteresis Below window bit Above window bit Notes the value set in the alarm temperature lower boundary trip register Hyst is the value set ...

Page 16

Temperature Format The temperature trip point registers and temperature readout register use a “2’s complement” format to enable negative numbers. The least significant bit (LSB) is equal to 0.0625°C or 0.25°C depending on which register is referenced example, ...

Page 17

Temperature Register The temperature register is a read-only register that provides the current temperature detected by the temperature sensor. The LSB for this register is 0.0625°C with a resolu- tion of 0.0625°C. The most significant bit (MSB) is 128°C in ...

Page 18

... U8 U9 U10 3.0 (0.12) TYP 39.0 (1.535) 21.0 (0.827) TYP TYP 24.8 (0.976) TYP 18 Module Dimensions 3.8 (0.15) 30.15 (1.187) 29.85 (1.175) 20.0 (0.787) TYP 1.1 (0.043) 0.9 (0.035) Pin 203 4.0 (0.157) TYP Pin 2 Micron Technology, Inc., reserves the right to change products or specifications without notice. ...

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