MT8HTF6464HDY-667F1 Micron Technology Inc, MT8HTF6464HDY-667F1 Datasheet
MT8HTF6464HDY-667F1
Specifications of MT8HTF6464HDY-667F1
Related parts for MT8HTF6464HDY-667F1
MT8HTF6464HDY-667F1 Summary of contents
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... DDR2 SDRAM SODIMM MT8HTF3264HDY – 256MB MT8HTF6464HDY – 512MB MT8HTF12864HDY – 1GB Features • 200-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300, or PC2-6400 • 256MB (32 Meg x 64), 512MB (64 Meg x 64), or 1GB (128 Meg x 64) • ...
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... DDR2 SDRAM Module 2 Part Number Density MT8HTF6464HDY-80E__ MT8HTF6464HTY-80E__ MT8HTF6464HDY-800__ MT8HTF6464HTY-800__ MT8HTF6464HDY-667__ MT8HTF6464HTY-667__ MT8HTF6464HDY-53E__ MT8HTF6464HTY-53E__ MT8HTF6464HDY-40E__ MT8HTF6464HTY-40E__ PDF: 09005aef80ebed66 htf8c32_64_128x64hd.pdf - Rev. E 3/10 EN 256MB, 512MB, 1GB (x64, DR) 200-Pin DDR2 SODIMM 256MB 8K 8K A[12:0] 4 BA[1:0] 256Mb (16 Meg x 16) 512 A[8:0] 2 S#[1:0] Module ...
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... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT8HTF6464HDY-667D3. PDF: 09005aef80ebed66 htf8c32_64_128x64hd.pdf - Rev. E 3/10 EN ...
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Pin Assignments and Descriptions Table 6: Pin Assignments 200-Pin DDR2 SODIMM Front Pin Symbol Pin Symbol Pin DQS2 101 REF 103 DQ0 55 DQ18 105 7 DQ1 57 DQ19 107 ...
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... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR2 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 7: Pin Descriptions Symbol Type Ax Input BAx Input ...
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... SPD EEPROM power supply: 1.7–3.6V. Reference voltage: V /2. DD Ground. No connect: These pins are not connected on the module. No function: These pins are connected within the module, but provide no functionality. Not used: These pins are not used in specific module configurations/operations. Reserved for future use. 6 Pin Descriptions and V ...
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Functional Block Diagram Figure 2: Functional Block Diagram S1# S0# CS# UDQS DQS0 UDQS# DQS0# UDM DM0 DQ DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 U1 DQ DQ7 DQS1 LDQS DQS1# LDQS# DM1 LDM ...
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... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...
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... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in the device data sheet are not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...
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... Component specifications are available on Micron's Web site. Module speed grades cor- relate with component speed grades. Table 9: Module and Component Speed Grades DDR2 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1GA ...
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I Specifications DD Table 10: DDR2 I Specifications and Conditions – 256MB DD Values shown for MT47H16M16 DDR2 SDRAM only and are computed from values specified in the 256Mb (16 Meg x 16) component data sheet Parameter Operating one bank ...
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... DD DD HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching 1. Value calculated as one module rank in this operating condition; all other module ranks Notes: 2. Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80ebed66 htf8c32_64_128x64hd ...
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Table 11: DDR2 I Specifications and Conditions – 512MB DD Values shown for MT47H32M16 DDR2 SDRAM only and are computed from values specified in the 512Mb (32 Meg x 16) component data sheet Parameter Operating one bank active-precharge current: t ...
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Table 11: DDR2 I Specifications and Conditions – 512MB (Continued) DD Values shown for MT47H32M16 DDR2 SDRAM only and are computed from values specified in the 512Mb (32 Meg x 16) component data sheet Parameter Operating bank interleave read current: ...
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Table 12: DDR2 I Specifications and Conditions – 1GB (Die Revision A) DD Values shown for MT47H64M16 DDR2 SDRAM only and are computed from values specified in the 1Gb (64 Meg x 16) com- ponent data sheet Parameter Operating one ...
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Table 13: DDR2 I Specifications and Conditions – 1GB (Die Revision E and G) DD Values shown for MT47H64M16 DDR2 SDRAM only and are computed from values specified in the 1Gb (64 Meg x 16) com- ponent data sheet Parameter ...
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Table 13: DDR2 I Specifications and Conditions – 1GB (Die Revision E and G) (Continued) DD Values shown for MT47H64M16 DDR2 SDRAM only and are computed from values specified in the 1Gb (64 Meg x 16) com- ponent data sheet ...
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Serial Presence-Detect For the latest SPD data, refer to Micron's SPD page: www.micron.com/SPD. Table 14: SPD EEPROM Operating Conditions Parameter/Condition Supply voltage Input high voltage: logic 1; All inputs Input low voltage: logic 0; All inputs Output low voltage: I ...
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... TYP Pin 1 63.6 (2.504) TYP Back view 4.2 (0.165) TYP 47.4 (1.87) TYP additional design dimensions. times occur. 19 Module Dimensions U4 31.15 (1.187) 29.85 (1.175) 20.0 (0.787) TYP 0.6 (0.024) TYP Pin 199 U9 4.0 (0.157) TYP Pin 2 11.4 (0.45) TYP 15.35 (0.6) TYP Micron Technology, Inc ...