MT8JSF25664HDZ-1G4D1 Micron Technology Inc, MT8JSF25664HDZ-1G4D1 Datasheet
MT8JSF25664HDZ-1G4D1
Specifications of MT8JSF25664HDZ-1G4D1
Related parts for MT8JSF25664HDZ-1G4D1
MT8JSF25664HDZ-1G4D1 Summary of contents
Page 1
... DDR3 SDRAM SODIMM MT8JSF12864HDZ – 1GB MT8JSF25664HDZ – 2GB Features • DDR3 functionality and operations supported as defined in the component data sheet • 204-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC3-12800, PC3-10600, PC3-8500, or PC3-6400 • 1GB (128 Meg x 64), 2GB (256 Meg x 64) • ...
Page 2
... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT8JSF25664HDZ-1G1D1. 09005aef83ccf92a jsf8c128_256x64hdz.pdf – Rev. A 10/09 EN ...
Page 3
... V 151 101 CK0 153 SS 51 DQ18 103 CK0# 155 Note: 1. Pin 119 is NC for 1GB modules and A13 for 2GB modules. 09005aef83ccf92a jsf8c128_256x64hdz.pdf – Rev. A 10/09 EN 1GB, 2GB (x64, DR) 204-Pin DDR3 SDRAM SODIMM Symbol Pin Symbol Pin Symbol V 157 DQ42 A10 ...
Page 4
... Input with write data. Center-aligned with write data. SDA I/O Serial data: SDA is a bidirectional pin used to transfer addresses and data into and out of the temperature sensor/SPD EEPROM on the module on the I Temperature event: The EVENT# pin is asserted by the temperature sensor when critical EVENT# Output (open drain) temperature thresholds have been exceeded ...
Page 5
... Termination voltage: Used for control, command, and address (V TT – connect: These pins are not connected on the module. – function: Connected within the module, but provides no functionality. 09005aef83ccf92a jsf8c128_256x64hdz.pdf – Rev. A 10/09 EN 1GB, 2GB (x64, DR) 204-Pin DDR3 SDRAM SODIMM Pin Assignments and Descriptions /2 Micron Technology, Inc ...
Page 6
... DQ Map Table 7: Component-to-Module DQ Map Component Reference Component Number DQ Module 09005aef83ccf92a jsf8c128_256x64hdz.pdf – Rev. A 10/09 EN 1GB, 2GB (x64, DR) 204-Pin DDR3 SDRAM SODIMM Component Module Pin Reference Number Number 141 U4 37 132 38 140 33 131 35 143 32 129 39 142 36 130 45 148 47 160 41 149 46 158 44 146 ...
Page 7
... Table 7: Component-to-Module DQ Map (Continued) Component Reference Component Number DQ Module 09005aef83ccf92a jsf8c128_256x64hdz.pdf – Rev. A 10/09 EN 1GB, 2GB (x64, DR) 204-Pin DDR3 SDRAM SODIMM Component Module Pin Reference Number Number 61 182 U7 58 191 57 183 62 192 60 180 63 194 56 181 59 193 50 175 48 163 54 174 49 165 51 177 ...
Page 8
Functional Block Diagram Figure 2: Functional Block Diagram S1# S0# DQS DQS0 DQS# DQS0# DM DM0 DQ0 DQ DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1 DQS DQS1# DQS# DM1 DM DQ DQ8 ...
Page 9
... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...
Page 10
... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...
Page 11
... Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 10: Module and Component Speed Grades DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1G6 ...
Page 12
... Self refresh temperature current (SRT-enabled): MAX T = 95°C C All banks interleaved read current Reset current 1. One module rank in the active I Notes: 2. All ranks in this I Table 12: DDR3 I Specifications and Conditions – 2GB DD Values are for the MT41J1284M16 DDR3 SDRAM only and are computed from values specified in the 2Gb (128 Meg x 16) ...
Page 13
... Self refresh temperature current: MAX T Self refresh temperature current (SRT-enabled): MAX T = 95°C C All banks interleaved read current Reset current 1. One module rank in the active I Notes: 2. All ranks in this I 09005aef83ccf92a jsf8c128_256x64hdz.pdf – Rev. A 10/09 EN 1GB, 2GB (x64, DR) 204-Pin DDR3 SDRAM SODIMM Symbol ...
Page 14
... TSE2002av, Serial Presence Detect with Temperature Sensor.” Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45, “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules.” ...
Page 15
Table 14: Sensor and EEPROM Serial Interface Timing (Continued) Parameter/Condition Start condition setup time Stop condition setup time EVENT# Pin The temperature sensor also adds the EVENT# pin (open drain). Not used by the SPD EEPROM, EVENT temperature ...
Page 16
Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 15: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...
Page 17
Table 16: Pointer Register Bits 0– Table 17: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...
Page 18
Table 19: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 20: Configuration Register (Address: 0x01) 15 ...
Page 19
Table 21: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...
Page 20
Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 22: Hysteresis Applied to Alarm ...
Page 21
Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...
Page 22
Table 26: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 27: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...
Page 23
... U7 U8 U10 3.0 (0.12) TYP 39.0 (1.535) 21.0 (0.827) TYP 24.8 (0.976) times occur. 23 Micron Technology, Inc. reserves the right to change products or specifications without notice. Module Dimensions 30.15 (1.187) U4 29.85 (1.175) 20.0 (0.787) TYP TYP Pin 203 U9 4.0 (0.157) TYP Pin 2 ...