ISP1760ET,557 NXP Semiconductors, ISP1760ET,557 Datasheet - Page 101

• Manufacturer Part Number: ISP1760ET,557
• Manufacturer: NXP Semiconductors

Specifications of ISP1760ET,557

• Package Type: TFBGA
• Pin Count: 128
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
ISP1760_4
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 101. SnPb eutectic process (from J-STD-020C)
Table 102. Lead-free process (from J-STD-020C)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 101
and
Figure
102
25.
Rev. 04 — 4 February 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
Embedded Hi-Speed USB host controller
350 to 2000
260
250
245
25) than a SnPb process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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