ISP1760ET,557

Manufacturer Part NumberISP1760ET,557
ManufacturerNXP Semiconductors
ISP1760ET,557 datasheet
 


Specifications of ISP1760ET,557

Package TypeTFBGAPin Count128
Lead Free Status / RoHS StatusCompliant  
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NXP Semiconductors
TFBGA128: plastic thin fine-pitch ball grid array package; 128 balls; body 9 x 9 x 0.8 mm
ball A1
index area
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
ball A1
1
3
index area
2
4
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
A
b
1
2
max
0.25
0.85
0.35
mm
1.1
0.15
0.75
0.25
OUTLINE
VERSION
IEC
SOT857-1
Fig 24. Package outline SOT857-1 (TFBGA128)
ISP1760_4
Product data sheet
D
B
A
E
e
1
v
e
b
1/2 e
w
e
1/2 e
5
7
9
11
13
15
6
8
10
12
14
16
0
2.5
scale
D
E
e
e
e
v
1
2
9.1
9.1
0.5
7.5
7.5
0.15
8.9
8.9
REFERENCES
JEDEC
JEITA
MO-195
Rev. 04 — 4 February 2008
Embedded Hi-Speed USB host controller
A
2
A
A
1
detail X
C
y
y
C
A
B
C
M
1
C
M
e
2
X
5 mm
w
y
y
1
0.05
0.08
0.1
EUROPEAN
PROJECTION
ISP1760
SOT857-1
ISSUE DATE
04-05-05
04-06-22
© NXP B.V. 2008. All rights reserved.
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