ISP1760ET,557 NXP Semiconductors, ISP1760ET,557 Datasheet - Page 99

• Manufacturer Part Number: ISP1760ET,557
• Manufacturer: NXP Semiconductors

Specifications of ISP1760ET,557

• Package Type: TFBGA
• Pin Count: 128
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
Fig 24. Package outline SOT857-1 (TFBGA128)
ISP1760_4
Product data sheet
TFBGA128: plastic thin fine-pitch ball grid array package; 128 balls; body 9 x 9 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT857-1
VERSION
OUTLINE
max
1.1
A
ball A1
index area
ball A1
index area
0.25
0.15
A
1
M
K
H
D
B
T
P
F
R
N
G
C
A
L
J
E
0.85
0.75
A
2
IEC
1
2
0.35
0.25
b
3
4
e
5
9.1
8.9
D
6
7
8
MO-195
JEDEC
e
D
9.1
8.9
1
9
E
10
1/2 e
11
REFERENCES
12
0.5
e
13
Rev. 04 — 4 February 2008
14
0
b
15
7.5
e
16
1
JEITA
7.5
scale
e
2.5
1/2 e
2
B
e
0.15
E
w
A
v
v
e
M
M
2
5 mm
C
C
0.05
w
A
Embedded Hi-Speed USB host controller
B
0.08
A
y
A
2
A
0.1
y
y
1
1
1
C
PROJECTION
EUROPEAN
detail X
C
X
y
© NXP B.V. 2008. All rights reserved.
ISP1760
ISSUE DATE
04-05-05
04-06-22
SOT857-1
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