ISP1760BE,557 NXP Semiconductors, ISP1760BE,557 Datasheet - Page 103

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ISP1760BE,557

Manufacturer Part Number
ISP1760BE,557
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of ISP1760BE,557

Package Type
LQFP
Pin Count
128
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
18. Abbreviations
ISP1760_4
Product data sheet
17.4 Package related soldering information
Table 103. Suitability of through-hole mount IC packages for dipping and wave soldering
[1]
[2]
Table 104. Abbreviations
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Acronym
ACK
ASIC
ATL
ATX
CS
DMA
DW
EHCI
EMI
EOP
EOT
ESD
ESR
FIFO
FLS
FS
GPIO
HC
HNP
HS
iTD
INT
ISO
ISR
ITL
LS
NAK
NYET
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Description
Acknowledgment
Application-Specific Integrated Circuit
Asynchronous Transfer List
Analog Transceiver
Complete Split
Direct Memory Access
Double Word
Enhanced Host Controller Interface
ElectroMagnetic Interference
End-Of-Packet
End-Of-Transfer
ElectroStatic Discharge
Effective Series Resistance
First In, First Out
Frame List Size
Full-Speed
General-Purpose Input/Output
Host Controller
Host Negotiation Protocol
High-Speed
isochronous Transfer Descriptor
Interrupt
Isochronous
Interrupt Service Routine
Isochronous (ISO) Transfer List
Low-Speed
Not Acknowledged
Not Yet
Rev. 04 — 4 February 2008
Soldering method
Dipping
-
suitable
-
Embedded Hi-Speed USB host controller
Wave
suitable
suitable
not suitable
© NXP B.V. 2008. All rights reserved.
ISP1760
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