MC9S12D64MFUE Freescale, MC9S12D64MFUE Datasheet - Page 93

MC9S12D64MFUE

Manufacturer Part Number
MC9S12D64MFUE
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S12D64MFUE

Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
25MHz
Interface Type
CAN/I2C/SCI/SPI
Total Internal Ram Size
4KB
# I/os (max)
49
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.25V
Operating Supply Voltage (min)
2.35/4.5V
On-chip Adc
2(8-chx10-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
80
Package Type
PQFP
Program Memory Type
Flash
Program Memory Size
64KB
Lead Free Status / RoHS Status
Compliant

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A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
Num C
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
10
1
2
3
4
5
6
7
8
9
T Thermal Resistance LQFP112, single sided PCB
T
T Junction to Board LQFP112
T Junction to Case LQFP112
T Junction to Package Top LQFP112
T Thermal Resistance QFP 80, single sided PCB
T
T Junction to Board QFP80
T Junction to Case QFP80
T Junction to Package Top QFP80
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
Table A-5 Thermal Package Characteristics
3
Rating
2
Symbol
JA
JA
JB
JC
JA
JA
JB
JC
JT
JT
MC9S12DJ64 Device User Guide — V01.20
Min
1
Typ
Max
54
41
31
11
51
41
27
14
2
3
o
o
o
o
o
o
o
o
o
o
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
93

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