PALCE16V8-10JC Cypress Semiconductor Corp, PALCE16V8-10JC Datasheet - Page 9

• Manufacturer Part Number: PALCE16V8-10JC
• Manufacturer: Cypress Semiconductor Corp

Specifications of PALCE16V8-10JC

• Family Name: Pal®
• Process Technology: EECMOS
• # Macrocells: 8
• # I/os (max): 8
• Frequency (max): 83MHz
• Propagation Delay Time: 10ns
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (max): 5.25V
• Operating Temp Range: 0C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 20
• Supply Current: 90mA
• Lead Free Status / RoHS Status: Not Compliant

Document #: 38-03025 Rev. *A
Ordering Information
Shaded areas contain preliminary information.
(mA)
130
130
130
130
115
115
I
90
90
90
55
65
55
65
55
65
CC
(ns)
t
7.5
10
10
10
15
15
25
25
10
10
15
15
25
25
PD
5
(ns)
7.5
7.5
7.5
10
12
12
15
15
10
12
12
15
15
t
3
5
S
(ns)
t
10
10
12
12
10
10
12
12
CO
4
5
7
7
7
7
7
PALCE16V8-5JC
PALCE16V8-7JC
PALCE16V8-7PC
PALCE16V8-10JC
PALCE16V8-10PC
PALCE16V8-10JI
PALCE16V8-10PI
PALCE16V8-10DMB
PALCE16V8-10LMB
PALCE16V8-15JC
PALCE16V8-15PC
PALCE16V8-15PI
PALCE16V8-15DMB
PALCE16V8-15LMB
PALCE16V8-25JC
PALCE16V8-25PC
PALCE16V8-25JI
PALCE16V8-25DMB
PALCE16V8-25LMB
PALCE16V8L-10JC
PALCE16V8L-10PC
PALCE16V8L-10JI
PALCE16V8L-10PI
PALCE16V8L-15JC
PALCE16V8L-15PC
PALCE16V8L-15DMB
PALCE16V8L-15LMB
PALCE16V8L-25JC
PALCE16V8L-25PC
PALCE16V8L-25DMB
PALCE16V8L-25LMB
Ordering Code
Package
Name
J61
J61
J61
J61
L61
J61
L61
J61
J61
L61
J61
J61
J61
L61
J61
L61
D6
D6
D6
D6
D6
P5
P5
P5
P5
P5
P5
P5
P5
P5
P5
20-Lead Plastic Leaded Chip Carrier
20-Lead Plastic Leaded Chip Carrier
20-Lead (300-Mil) Molded DIP
20-Lead (300-Mil) Molded DIP
20-Lead (300-Mil) CerDIP
20-Pin Square Leadless Chip Carrier
20-Lead (300-Mil) Molded DIP
20-Lead(300Mil) Molded DIP
20-Lead (300-Mil) CerDIP
20-Pin Square Leadless Chip Carrier
20-Lead (300-Mil) Molded DIP
20-Lead Plastic Leaded Chip Carrier
20-Lead (300-Mil) CerDIP
20-Pin Square Leadless Chip Carrier
20-Lead (300-Mil) Molded DIP
20-Lead (300-Mil) Molded DIP
20-Lead (300-Mil) Molded DIP
20-Lead (300-Mil) CerDIP
20-Lead (300-Mil) Molded DIP
20-Lead (300-Mil) CerDIP
20-Lead Plastic Leaded Chip Carrier
20-Lead (300-Mil) Molded DIP
20-Lead Plastic Leaded Chip Carrier
20-Lead Plastic Leaded Chip Carrier
20-Lead Plastic Leaded Chip Carrier
20-Lead Plastic Leaded Chip Carrier
20-Lead Plastic Leaded Chip Carrier
20-Lead Plastic Leaded Chip Carrier
20-Pin Square Leadless Chip Carrier
20-Lead Plastic Leaded Chip Carrier
20-Pin Square Leadless Chip Carrier
Package Type
PALCE16V8
Commercial
Commercial
Industrial
Military
Commercial
Industrial
Military
Commercial
Industrial
Military
Commercial
Industrial
Commercial
Military
Commercial
Military
Operating
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