MPXV7007DP Freescale, MPXV7007DP Datasheet
MPXV7007DP
Specifications of MPXV7007DP
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MPXV7007DP Summary of contents
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... Series - kPa (- psi) 0.5 to 4.5 V Output Application Examples • Hospital Beds • HVAC • Respiratory Systems • Process Control Pressure Type Device Marking Gauge Differential Absolute MPXV7007G • MPXV7007G • MPXV7007GP • MPXV7007DP • MPXV7007G • MPXV7007G • MPXV7007DP CASE 1351-01 ...
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... FSS ±5.0 — — — — 286 —- t — 1.0 —- R — 0.1 —- O+ — — 20 —- ±0.5 — — — 25°C. FSS Freescale Semiconductor Unit kPa Vdc mAdc Vdc Vdc Vdc %V FSS mV/kPa ms mAdc ms %V FSS Sensors ...
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... Storage Temperature Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Sensing Element Figure 1. Integrated Pressure Sensor Schematic Sensors Freescale Semiconductor Symbol P max T stg ...
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... Element Figure 2. Cross-Sectional Diagram SOP (not to scale out V s IPS 1.0 µF 0.01 µF GND shows the recommended decoupling circuit for shows the sensor output signal relative to Figure Stainless Steel Cap Thermoplastic Case Die Bond OUTPUT 470 pF Freescale Semiconductor 3. The Sensors ...
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... Temperature Error Band 4.0 3.0 Temperature 2.0 Error Factor 1.0 0.0 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Sensors Freescale Semiconductor Transfer Function *(0.057*P+0.5) ± ERROR out 5.0 Vdc S TEMP = 0 to 85°C ...
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... Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The pressure Part Number MPXV7007GC6U/C6T1 MPXV7007GP MPXV7007DP MPXV7007G6U/T1 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package ...
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... Sensors Freescale Semiconductor PACKAGE DIMENSIONS 0.25 (0.010 PIN 1 IDENTIFIER M CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE 0.25 (0.010 -T- SEATING PIN 1 IDENTIFIER PLANE CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE Pressure NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. ...
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... BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 M 0.270 0.290 6.86 7.37 N 0.160 0.180 4.06 4.57 P 0.009 0.011 0.23 0.28 T 0.110 0.130 2.79 3.30 θ 0˚ 7˚ 0˚ 7˚ Freescale Semiconductor Sensors ...
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... PLACES 4 TIPS 0.008 (0.20 0.004 (0. ∅ 0.004 (0. DETAIL G C Sensors Freescale Semiconductor PACKAGE DIMENSIONS GAGE e PLANE e/2 .014 (0.35 SEATING PLANE CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE Pressure θ DETAIL G NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. ...
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... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...