EMIF06-10006F2

... Mobile phones and communication systems ■ Computers, printers and MCU Boards Description The EMIF06-10006F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges ...

... MHz (on filter cells) line R 2/9 100 Ω Output 1 Input 100 Ω Output 2 Input 100 Ω Output 3 Input Parameter and test conditions = 25 °C) amb Parameter RM Test conditions EMIF06-10006F2 100 Ω Output 100 Ω Output 100 Ω Output Value 0.1 0.6 125 - 125 ...

... EMIF06-10006F2 Figure 3. S21 (db) attenuation measurements and Aplac simulation 0.00 0. -12.50 -12.50 -25.00 -25.00 -37.50 -37.50 Measurement Measurement Measurement Simulation Simulation Simulation -50.00 -50.00 100.0k 100.0k 1.0M 1.0M 10.0M 10.0M Figure 5. Digital crosstalk measurements Figure 7. ESD response to IEC 61000-4-2 (–15 kV air discharge) on one imput ...

... Output of each filter cell Ii* = Input of each filter cell Figure 10. Figure 10: Aplac parameters 4/9 Rs=100 Lbump Rbump Cz=41pF@0V Cz=41pF@0V Rsub sub sub EMIF06-10006F2 model aplacvar RS aplacvar Cz aplacvar Lbump aplacvar Rbump aplacvar Cbump aplacvar Rsub aplacvar Rgnd aplacvar Lgnd aplacvar Cgnd EMIF06-10006F2 Oi* ...

... EMIF06-10006F2 2 Ordering Information Scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF letters = application 2 digits = version Package F = Flip-Chip Lead free Pitch = 500 µm, Bump = 315 µm Ordering Information Scheme EMIF yy - xxx zz Fx 5/9 ...

... Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter 6/9 315 µm ± 50 2.92 mm ± 50 µm Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) EMIF06-10006F2 650 µm ± ...

... EMIF06-10006F2 Figure 14. Flip-Chip Tape and reel specification 0.73 +/- 0.05 All dimensions order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97 ...

... Revision 1 First issue Figure 2 on page 2: 2 Basic cell configuration corrected for I/O5 and I/O6. Reformated to current standard. Marking corrected in 3 ordering information. 4 Ordering code in ordering information corrected. EMIF06-10006F2 Base qty Delivery mode 5000 Tape and reel 7” Description of Changes ...

... EMIF06-10006F2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...