Conn Backplane F 160 POS 1.27mm Press Fit RA Thru-Hole

 

5149031-1

Manufacturer Part Number5149031-1
DescriptionConn Backplane F 160 POS 1.27mm Press Fit RA Thru-Hole
ManufacturerTE Connectivity
TypeBackplane
5149031-1 datasheets

Availability: By request

International delivery:

Warranty: 60 days

Shipping & payment terms

Added to cart

 

Specifications of 5149031-1

Pitch1.27 mmNumber Of Contacts160
Termination MethodPress FitMountingThrough Hole
Contact PlatingGoldProduct TypeConnector
Mount AngleRight AngleTermination Method To Pc BoardThrough Hole - Solder
Pcb Mount RetentionWithoutGuidesWith
Flame RetardantYesBus Bar MaterialPhosphor Bronze
Tail Length (mm [in])3.18 [0.125]Bus Bar Mating Area PlatingGold (30)
Bus Bar Termination Area PlatingMatte Tin with Nickel underplatedNumber Of Positions160
Signal Contact MaterialPhosphor BronzeSignal Contact Mating Area PlatingGold (30)
Signal Contact Termination Area PlatingMatte Tin with Nickel underplatedConnector StyleReceptacle
Housing MaterialHigh Temperature ThermoplasticRohs/elv ComplianceRoHS compliant, ELV compliant
Lead Free Solder ProcessesWave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°CRohs/elv Compliance HistoryAlways was RoHS compliant
1
Page 1
2
Page 2
3
Page 3
4
Page 4
5
Page 5
6
Page 6
7
Page 7
8
Page 8
Page 1/8

Download datasheet (507Kb)Embed
Next
Product
Specification
Micro-Strip Board to Board Connector
1.
SCOPE
1.1.
Content
This specification covers perform ance, tests and quality requirem ents for TE Connectivity (TE) Micro-
Strip board to board right angle and vertical connector fam ily. These assem blies accom m odate a variety
of printed circuit board thicknesses. Plug assem blies are loaded with .015 inch square m ale Micro-Strip
contacts which m ate with receptacle assem blies loaded with fem ale Micro-Strip contacts.
1.2.
Qualification
W hen tests are perform ed on subject product line, procedures specified in 109 Series Test
Specifications shall be used. All inspections shall be perform ed using applicable inspection plan and
product drawing.
2.
APPLICABLE DOCUM ENTS
The following docum ents form a part of this specification to the extent specified herein. Unless
otherwise specified, latest edition of the docum ent applies. In the event of conflict between
requirem ents of this specification and product drawing, product drawing shall take precedence. In the
event of conflict between requirem ents of this specification and referenced docum ents, this specification
shall take precedence.
2.1.
TE Docum ents
!
109-1: General Requirem ents for Test Specifications
!
109 Series: Test Specifications as indicated in Figure 1
!
114-11005: Application Specification
!
501-235: Test Report
3.
REQUIREM ENTS
3.1.
Design and Construction
Product shall be of design, construction and physical dim ensions specified on applicable product
drawing.
3.2.
Materials
!
Contact: Phosphor bronze or beryllium copper, selective gold over nickel plating
!
Housing: High tem perature therm oplastic, liquid crystal polym er
3.3.
Ratings
!
Voltage: 30 volts alternating current
!
Current: See Figure 2 for applicable current carrying capability
!
Tem perature: -65 to 125 C
©2011 Tyco Electronics Corporation,
| Indicates change
a TE Connectivity Ltd. Company
*Trademark
All Rights Reserved
TE logo is a trademark.
For latest revision, visit our website at
www.te.com/documents.
For Regional Customer Service, visit our website at www.te.com
Other products, logos, and company names might be trademarks of their respective owners.
108-1272
11Mar11 Rev A
1 of 8
LOC B

5149031-1 Summary of contents

  • Page 1

    ... Content This specification covers perform ance, tests and quality requirem ents for TE Connectivity (TE) Micro- Strip board to board right angle and vertical connector fam ily. These assem blies accom m odate a variety of printed circuit board thicknesses. Plug assem blies are loaded with .015 inch square m ale Micro-Strip contacts which m ate with receptacle assem blies loaded with fem ale Micro-Strip contacts ...

  • Page 2

    Perform ance and Test Description Product is designed to m eet electrical, m echanical and environm ental perform ance requirem ents specified in Figure 1. All tests are perform bient environm ental conditions per Test Specification ...

  • Page 3

    Test Description Mating force. Unm ating force. Durability. Therm al shock. Hum idity-tem perature cycling. Mixed flowing gas. Tem perature life. Shall meet visual requirements, show no physical damage and shall meet requirements of NOTE additional tests as specified in ...

  • Page 4

    Loading Configuration Single (1 bus contact) 40% (2 bus contacts) 100% (5 bus contacts) 50% signal contacts pere, tem perature rise at 100% bus contact To determine acceptable current carrying capacity for percentage connector loading, use NOTE ...

  • Page 5

    Product Qualification and Requalification Test Sequence Exam ination of product Term ination resistance, dry circuit Dielectric withstanding voltage Insulation resistance Tem perature rise vs current Vibration Physical shock Mating force Unm ating force Durability Therm al shock Hum idity-tem ...

  • Page 6

    QUALITY ASSURANCE PROVISIONS 4.1. Qualification Testing A. Sam ple Selection Connector housings and contacts shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. Test group 1 shall consist of 5 ...

  • Page 7

    Resistance and Tem perature Measurem ent Points Rev A Figure 4 108-1272 ...

  • Page 8

    Mounting and Clam ping Location for Vibration and Physical Shock Rev A Figure 5 108-1272 ...