LFXP2-40E-6FN672C

Manufacturer Part NumberLFXP2-40E-6FN672C
DescriptionIC DSP 40KLUTS 540I/O 672FPBGA
ManufacturerLattice
LFXP2-40E-6FN672C datasheets

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Specifications of LFXP2-40E-6FN672C

Number Of Logic Elements/cells*Number Of Labs/clbs*
Total Ram Bits906240Number Of I /o540
Number Of Gates-Voltage - Supply1.14 V ~ 1.26 V
Mounting Type*Operating Temperature0°C ~ 85°C
Package / Case*Lead Free Status / Rohs StatusLead free / RoHS Compliant
Other names220-1129  
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February 2008
Features
 flexiFLASH™ Architecture
• Instant-on
• Infinitely reconfigurable
• Single chip
• FlashBAK™ technology
• Serial TAG memory
• Design security
 Live Update Technology
• TransFR™ technology
• Secure updates with 128 bit AES encryption
• Dual-boot with external SPI
 sysDSP™ Block
• Three to eight blocks for high performance 
Multiply and Accumulate
• 12 to 32 18x18 multipliers
• Each block supports one 36x36 multiplier or four
18x18 or eight 9x9 multipliers
 Embedded and Distributed Memory
• Up to 885 Kbits sysMEM™ EBR
• Up to 83 Kbits Distributed RAM
 sysCLOCK™ PLLs
• Up to four analog PLLs per device
• Clock multiply, divide and phase shifting
Table 1-1. LatticeXP2 Family Selection Guide
Device
LUTs (K)
Distributed RAM (KBits)
EBR SRAM (KBits)
EBR SRAM Blocks
sysDSP Blocks
18 x 18 Multipliers
V
Voltage
CC
GPLL
Max Available I/O
Packages and I/O Combinations
132-Ball csBGA (8 x 8 mm)
144-Pin TQFP (20 x 20 mm)
208-Pin PQFP (28 x 28 mm)
256-Ball ftBGA (17 x17 mm)
484-Ball fpBGA (23 x 23 mm)
672-Ball fpBGA (27 x 27 mm)
© 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
LatticeXP2 Family Data Sheet
 Flexible I/O Buffer
• sysIO™ buffer supports:
– LVCMOS 33/25/18/15/12; LVTTL
– SSTL 33/25/18 class I, II
– HSTL15 class I; HSTL18 class I, II
– PCI
– LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
 Pre-engineered Source Synchronous
Interfaces
• DDR / DDR2 interfaces up to 200 MHz
• 7:1 LVDS interfaces support display applications
• XGMII
 Density And Package Options
• 5k to 40k LUT4s, 86 to 540 I/Os
• csBGA, TQFP , PQFP , ftBGA and fpBGA packages
• Density migration supported
 Flexible Device Configuration
• SPI (master and slave) Boot Flash Interface
• Dual Boot Image supported
• Soft Error Detect (SED) macro embedded
 System Level Support
• IEEE 1149.1 and IEEE 1532 Compliant
• On-chip oscillator for initialization & general use
• Devices operate with 1.2V power supply
XP2-5
XP2-8
XP2-17
5
8
10
18
166
221
9
12
3
4
12
16
1.2
1.2
2
2
172
201
86
86
100
100
146
146
172
201
1-1
Introduction
Data Sheet DS1009
XP2-30
XP2-40
17
29
35
56
276
387
15
21
5
7
20
28
1.2
1.2
4
4
358
472
146
201
201
358
363
472
DS1009
Introduction_01.2
40
83
885
48
8
32
1.2
4
540
363
540