LCMXO1200C-3BN256I Lattice, LCMXO1200C-3BN256I Datasheet - Page 81

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LCMXO1200C-3BN256I

Manufacturer Part Number
LCMXO1200C-3BN256I
Description
IC PLD 1200LUTS 211I/O 256CABGA
Manufacturer
Lattice
Datasheet

Specifications of LCMXO1200C-3BN256I

Programmable Type
*
Number Of Macrocells
*
Voltage - Input
*
Speed
*
Mounting Type
*
Package / Case
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
220-1063

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LCMXO1200C-3BN256I
Manufacturer:
Lattice
Quantity:
77
Part Number:
LCMXO1200C-3BN256I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Lattice Semiconductor
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following:
• TN1090 -
• Power Calculator tool included with the Lattice ispLEVER design tool, or as a standalone download from 
Thermal Management
www.latticesemi.com/software
Power Estimation and Management for MachXO Devices
document
Thermal Management
4-36
document to find the device/package
MachXO Family Data Sheet
Pinout Information

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