LPC1778FET208,551 NXP Semiconductors, LPC1778FET208,551 Datasheet - Page 109

• Manufacturer Part Number: LPC1778FET208,551
• Description: MCU ARM 512K FLASH 208-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1778FET208,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 165
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-TFBGA
• Processor Series: LPC177x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: SSP, I2S, USB, JTAG, Serial, UART, I2C, SD/MMC
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 165
• Number Of Timers: 4
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Supply Current (max): 100 mA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-6688

NXP Semiconductors
16. Soldering
LPC178X_7X
Objective data sheet
Fig 46. Reflow soldering of the LQFP208 package
Footprint information for reflow soldering of LQFP208 package
DIMENSIONS in mm
0.500
P1
0.560
P2
31.300 31.300 28.300 28.300
Hy
solder land
occupied area
Ax
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
0.280
Rev. 2 — 27 May 2011
Generic footprint pattern
D1
0.400 28.500 28.500 31.550 31.550
P1
D2
Gx
Hx
Bx
Ax
Gx
(0.125)
Gy
32-bit ARM Cortex-M3 microcontroller
Hx
D1
Hy
LPC178x/7x
By
© NXP B.V. 2011. All rights reserved.
Ay
sot459-1_fr
SOT459-1
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